Inventor
JIANG ZHIJUN
US22 patents
⚠️ This page may combine multiple inventors who share the name “JIANG ZHIJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
21 patentsUS9157730B2Oct 13, 2015
PECVD process
APPLIED MATERIALS INC49 citations97
US9816187B2Nov 14, 2017
PECVD process
APPLIED MATERIALS INC8 citations92
US9458537B2Oct 4, 2016
PECVD process
APPLIED MATERIALS INC12 citations92
US10793954B2Oct 6, 2020
PECVD process
APPLIED MATERIALS INC3 citations84
US10060032B2Aug 28, 2018
PECVD process
APPLIED MATERIALS INC3 citations84
US11613812B2Mar 28, 2023
PECVD process
APPLIED MATERIALS INC2 citations73
US10276353B2Apr 30, 2019
Dual-channel showerhead for formation of film stacks
APPLIED MATERIALS INC4 citations71
US10600624B2Mar 24, 2020
System and method for substrate processing chambers
APPLIED MATERIALS INC5 citations70
US11898249B2Feb 13, 2024
PECVD process
APPLIED MATERIALS INC0 citations62
US10030306B2Jul 24, 2018
PECVD apparatus and process
APPLIED MATERIALS INC1 citations62
US12381106B2Aug 5, 2025
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
APPLIED MATERIALS INC0 citations61
US12315724B2May 27, 2025
Helium-free silicon formation
APPLIED MATERIALS INC0 citations61
US12211908B2Jan 28, 2025
Profile shaping for control gate recesses
APPLIED MATERIALS INC0 citations61
US11837448B2Dec 5, 2023
High-temperature chamber and chamber component cleaning and maintenance method and apparatus
APPLIED MATERIALS INC0 citations61
US11784229B2Oct 10, 2023
Profile shaping for control gate recesses
APPLIED MATERIALS INC1 citations61
US11646216B2May 9, 2023
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
APPLIED MATERIALS INC1 citations61
US12094689B2Sep 17, 2024
Switchable delivery for semiconductor processing system
APPLIED MATERIALS INC0 citations60
US11430641B1Aug 30, 2022
Processing systems and methods to control process drift
APPLIED MATERIALS INC0 citations57
US10553427B2Feb 4, 2020
Low dielectric constant oxide and low resistance OP stack for 3D NAND application
APPLIED MATERIALS INC0 citations52
US11145504B2Oct 12, 2021
Method of forming film stacks with reduced defects
APPLIED MATERIALS INC0 citations45
US10777394B2Sep 15, 2020
Virtual sensor for chamber cleaning endpoint
APPLIED MATERIALS INC0 citations45