Inventor
LIU ZHONGNING
US3 patents
Patents
3 patentsUS12334252B2Jun 17, 2025
Substrate comprising an inductive coupler for signal leakage reduction
QUALCOMM INC0 citations56
US11823831B2Nov 21, 2023
Substrate comprising an inductive coupler for signal leakage reduction
QUALCOMM INC0 citations56
US11270951B2Mar 8, 2022
Substrate comprising at least one patterned ground plane for shielding
QUALCOMM INC0 citations56