Inventor

KIM DAEIK DANIEL

US66 patents

⚠️ This page may combine multiple inventors who share the name “KIM DAEIK DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM DAEIK DANIEL

QUALCOMM INC

Varying thickness inductor

Skewed co-spiral inductor structure

Compartment shielding in flip-chip (FC) module

Passive-on-glass (POG) device and method

Backside coupled symmetric varactor structure

Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)

Backside coupled symmetric varactor structure

High pass filters and low pass filters using through glass via technology

Low package parasitic inductance using a thru-substrate interposer

Package on package (PoP) integrated device comprising a capacitor in a substrate

Substrate comprising an embedded inductor and a thin film magnetic core

Encapsulation of acoustic resonator devices

Nested through glass via transformer

Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications

Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications

Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter

Passive device assembly for accurate ground plane control

MIM capacitor and method of making the same

Integrated circuits (ICS) on a glass substrate

Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits

Varactor device with backside contact

3D pillar inductor

Superposed structure 3D orthogonal through substrate inductor

Low DC resistance and high RF resistance power amplifier choke inductor

Segmented thermal and RF ground

Power amplifier with RF structure

Frequency multiplexer

3D pillar inductor

Stacked substrate inductor

Inductor with embraced corner capture pad

High performance inductors

Passive-on-glass (POG) device and method

Two-dimensional structure to form an embedded three-dimensional structure

Land grid array (LGA) packaging of passive-on-glass (POG) structure

Varying thickness inductor

Integrated circuits (ICs) on a glass substrate

Solenoid inductor

Tunable matching network

Passive device assembly for accurate ground plane control

Passive components implemented on a plurality of stacked insulators

Double-sided circuit

Open-passivation ball grid array pads

Wafer level package (WLP) ball support using cavity structure

Apparatus with 3D wirewound inductor integrated within a substrate

LC filter layer stacking by layer transfer to make 3D multiplexer structures

Solenoid inductor in a substrate

High quality factor capacitors and methods for fabricating high quality factor capacitors

Three-dimensional wire bond inductor

Superposed structure 3D orthogonal through substrate inductor

QUALCOMM MEMS TECHNOLOGIES INC

Compact 3-D coplanar transmission lines