Inventor
HSUEH CHANG-JUNG
TW23 patents
Patents
23 patentsUS12015002B2Jun 18, 2024
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11094655B2Aug 17, 2021
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12550769B2Feb 10, 2026
Method for forming a package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12543552B2Feb 3, 2026
Semiconductor device structure with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12463166B2Nov 4, 2025
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412858B2Sep 9, 2025
Semiconductor device structure with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12381171B2Aug 5, 2025
Semiconductor die including stress-resistant bonding structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12288730B2Apr 29, 2025
Semiconductor device, semiconductor package, and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237320B2Feb 25, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12068303B2Aug 20, 2024
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990440B2May 21, 2024
Structure and formation method of semiconductor device with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961944B2Apr 16, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961817B2Apr 16, 2024
Apparatus and method for forming a package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901256B2Feb 13, 2024
Semiconductor device, semiconductor package, and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11887955B2Jan 30, 2024
Semiconductor die including stress-resistant bonding structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11854964B2Dec 26, 2023
Structure and formation method of semiconductor device with conductive bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855058B2Dec 26, 2023
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742204B2Aug 29, 2023
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569419B2Jan 31, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004685B2May 11, 2021
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11171100B2Nov 9, 2021
Semiconductor device structure with protected bump and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12094792B2Sep 17, 2024
Package structure having lid with protrusion and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12476166B2Nov 18, 2025
Inverted trapezoidal heat dissipating solder structure and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51