Inventor
KANG CHIN-WEI
TW18 patents
Patents
18 patentsUS11094655B2Aug 17, 2021
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11101233B1Aug 24, 2021
Semiconductor device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10283471B1May 7, 2019
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12559362B2Feb 24, 2026
Micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961944B2Apr 16, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942445B2Mar 26, 2024
Semiconductor device with conductive pad
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851321B2Dec 26, 2023
Micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742204B2Aug 29, 2023
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569419B2Jan 31, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152319B2Oct 19, 2021
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004685B2May 11, 2021
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12438048B2Oct 7, 2025
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12230595B2Feb 18, 2025
Metal bumps and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12009256B2Jun 11, 2024
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11721579B2Aug 8, 2023
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11387143B2Jul 12, 2022
Redistribution lines with protection layers and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11024593B2Jun 1, 2021
Metal bumps and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10651142B2May 12, 2020
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51