Inventor
LIN CHENG-JEN
TW25 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHENG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
20 patentsUS11094655B2Aug 17, 2021
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11101233B1Aug 24, 2021
Semiconductor device and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10283471B1May 7, 2019
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11532692B2Dec 20, 2022
Process for tuning via profile in dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US11075173B2Jul 27, 2021
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations71
US10910466B2Feb 2, 2021
Process for tuning via profile in dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12559362B2Feb 24, 2026
Micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961944B2Apr 16, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942445B2Mar 26, 2024
Semiconductor device with conductive pad
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851321B2Dec 26, 2023
Micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742204B2Aug 29, 2023
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569419B2Jan 31, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152319B2Oct 19, 2021
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004685B2May 11, 2021
Multi-layer structures and methods of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12598995B2Apr 7, 2026
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12230595B2Feb 18, 2025
Metal bumps and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12136644B2Nov 5, 2024
Process for tuning via profile in dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11024593B2Jun 1, 2021
Metal bumps and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11171085B2Nov 9, 2021
Semiconductor device structure with magnetic layer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10651142B2May 12, 2020
Micro-connection structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51