P

Inventor

LIN CHENG-JEN

TW25 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHENG-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

20 patents
US11094655B2Aug 17, 2021

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11101233B1Aug 24, 2021

Semiconductor device and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10283471B1May 7, 2019

Micro-connection structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11532692B2Dec 20, 2022

Process for tuning via profile in dielectric material

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US11075173B2Jul 27, 2021

Semiconductor device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations71
US10910466B2Feb 2, 2021

Process for tuning via profile in dielectric material

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12559362B2Feb 24, 2026

Micro-electro mechanical system and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11961944B2Apr 16, 2024

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942445B2Mar 26, 2024

Semiconductor device with conductive pad

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851321B2Dec 26, 2023

Micro-electro mechanical system and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11742204B2Aug 29, 2023

Multi-layer structures and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569419B2Jan 31, 2023

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152319B2Oct 19, 2021

Micro-connection structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004685B2May 11, 2021

Multi-layer structures and methods of forming

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12598995B2Apr 7, 2026

Semiconductor device and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12230595B2Feb 18, 2025

Metal bumps and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12136644B2Nov 5, 2024

Process for tuning via profile in dielectric material

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11024593B2Jun 1, 2021

Metal bumps and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11171085B2Nov 9, 2021

Semiconductor device structure with magnetic layer and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10651142B2May 12, 2020

Micro-connection structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

MITAC INT CORP

2 patents

LIN CHENG JEN

2 patents

CHEN SOURCE INC

1 patent