Inventor
CHANG BO SOON
US20 patents
⚠️ This page may combine multiple inventors who share the name “CHANG BO SOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CYPRESS SEMICONDUCTOR CORP
18 patentsUS7939372B1May 10, 2011
Semiconductor device packaging using etched leadfingers
CYPRESS SEMICONDUCTOR CORP20 citations92
US7818085B1Oct 19, 2010
System for controlling the processing of an integrated circuit chip assembly line
CYPRESS SEMICONDUCTOR CORP19 citations92
US7105377B1Sep 12, 2006
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
CYPRESS SEMICONDUCTOR CORP21 citations92
US7031791B1Apr 18, 2006
Method and system for a reject management protocol within a back-end integrated circuit manufacturing process
CYPRESS SEMICONDUCTOR CORP27 citations92
US6649447B1Nov 18, 2003
Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames
CYPRESS SEMICONDUCTOR CORP15 citations92
US6316821B1Nov 13, 2001
High density lead frames and methods for plastic injection molding
CYPRESS SEMICONDUCTOR CORP18 citations92
US6215689B1Apr 10, 2001
Architecture, circuitry and method for configuring volatile and/or non-volatile memory for programmable logic applications
CYPRESS SEMICONDUCTOR CORP42 citations92
US6331728B1Dec 18, 2001
High reliability lead frame and packaging technology containing the same
CYPRESS SEMICONDUCTOR CORP22 citations89
US7939371B1May 10, 2011
Flip-flop semiconductor device packaging using an interposer
CYPRESS SEMICONDUCTOR CORP8 citations84
US6931298B1Aug 16, 2005
Integrated back-end integrated circuit manufacturing assembly
CYPRESS SEMICONDUCTOR CORP13 citations84
US6730545B1May 4, 2004
Method of performing back-end manufacturing of an integrated circuit device
CYPRESS SEMICONDUCTOR CORP13 citations83
US7698015B1Apr 13, 2010
Integrated back-end integrated circuit manufacturing assembly
CYPRESS SEMICONDUCTOR CORP6 citations73
US7045387B1May 16, 2006
Method of performing back-end manufacturing of an integrated circuit device
CYPRESS SEMICONDUCTOR CORP8 citations73
US6901984B1Jun 7, 2005
Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol
CYPRESS SEMICONDUCTOR CORP8 citations73
US6576491B1Jun 10, 2003
Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame
CYPRESS SEMICONDUCTOR CORP5 citations71
US9263398B1Feb 16, 2016
Semiconductor packaging identifier
CYPRESS SEMICONDUCTOR CORP2 citations62
US6730532B1May 4, 2004
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
CYPRESS SEMICONDUCTOR CORP5 citations62
US7608914B1Oct 27, 2009
Integrated circuit package with electrically isolated leads
CYPRESS SEMICONDUCTOR CORP2 citations54