Inventor
MIYAJIMA FUMIO
JP19 patents
Patents
19 patentsUS6344162B1Feb 5, 2002
Method of manufacturing semiconductor devices and resin molding machine
APIC YAMADA CORP155 citations98
US6080354AJun 27, 2000
Resin molding method in which a movable cavity piece allows a direct resin feed
APIC YAMADA CORP57 citations96
US5824252AOct 20, 1998
Method of resin molding and resin molding machine for the same
APIC YAMADA CORP74 citations96
US6261501B1Jul 17, 2001
Resin sealing method for a semiconductor device
APIC YAMADA CORP56 citations95
US6770236B2Aug 3, 2004
Method of resin molding
APIC YAMADA CORP26 citations92
US6478562B1Nov 12, 2002
Resin molding machine
APIC YAMADA CORP44 citations92
US6459159B1Oct 1, 2002
Apparatus for sealing a semiconductor device utilizing a release film
APIC YAMADA CORP25 citations92
US6444157B1Sep 3, 2002
Method of resin molding
APIC YAMADA CORP17 citations92
US6350113B1Feb 26, 2002
Resin molding machine
APIC YAMADA CORP31 citations92
US6187243B1Feb 13, 2001
Method of resin molding
APIC YAMADA CORP43 citations92
US6048483AApr 11, 2000
Resin sealing method for chip-size packages
APIC YAMADA CORP40 citations92
US5891483AApr 6, 1999
Automatic molding machine using release film
APIC YAMADA CORP41 citations92
US5891384AApr 6, 1999
Method of operating a molding machine with release film
APIC YAMADA CORP53 citations92
US5800841ASep 1, 1998
Resin molding machine
APIC YAMADA CORP20 citations92
US6743389B2Jun 1, 2004
Resin molding machine and method of resin molding
APIC YAMADA CORP43 citations91
US6224360B1May 1, 2001
Resin sealing device for chip-size packages
APIC YAMADA CORP15 citations84
US5507910AApr 16, 1996
Lead frame taping machine
APIC YAMADA CORP14 citations73
US7407608B2Aug 5, 2008
Resin molding equipment and resin molding method
APIC YAMADA CORP5 citations54
US7909596B2Mar 22, 2011
Resin molding machine and method of resin molding
APIC YAMADA CORP0 citations36