Inventor
LEK HU AH
MY7 patents
Patents
7 patentsUS6448107B1Sep 10, 2002
Pin indicator for leadless leadframe packages
NAT SEMICONDUCTOR CORP39 citations91
US6677667B1Jan 13, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP11 citations72
US6576989B1Jun 10, 2003
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP10 citations72
US6963124B1Nov 8, 2005
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP0 citations51
US6933174B1Aug 23, 2005
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6818970B1Nov 16, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6808961B1Oct 26, 2004
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP1 citations51