Inventor
YEEN CHAN PENG
MY13 patents
Patents
13 patentsUS7002239B1Feb 21, 2006
Leadless leadframe packaging panel featuring peripheral dummy leads
NAT SEMICONDUCTOR CORP19 citations91
US6448107B1Sep 10, 2002
Pin indicator for leadless leadframe packages
NAT SEMICONDUCTOR CORP39 citations91
US7186588B1Mar 6, 2007
Method of fabricating a micro-array integrated circuit package
NAT SEMICONDUCTOR CORP27 citations89
US7259460B1Aug 21, 2007
Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package
NAT SEMICONDUCTOR CORP21 citations88
US6933223B1Aug 23, 2005
Ultra-low loop wire bonding
NAT SEMICONDUCTOR CORP12 citations81
US6677667B1Jan 13, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP11 citations72
US6576989B1Jun 10, 2003
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP10 citations72
US7598122B1Oct 6, 2009
Die attach method and microarray leadframe structure
NAT SEMICONDUCTOR CORP7 citations71
US7859090B2Dec 28, 2010
Die attach method and leadframe structure
NAT SEMICONDUCTOR CORP2 citations60
US6963124B1Nov 8, 2005
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP0 citations51
US6933174B1Aug 23, 2005
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6818970B1Nov 16, 2004
Leadless leadframe package design that provides a greater structural integrity
NAT SEMICONDUCTOR CORP0 citations51
US6808961B1Oct 26, 2004
Locking of mold compound to conductive substrate panels
NAT SEMICONDUCTOR CORP1 citations51