Inventor
CHANG YI-MING
TW48 patents
⚠️ This page may combine multiple inventors who share the name “CHANG YI-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
16 patentsUS9611143B2Apr 4, 2017
Method for forming chip package
XINTEC INC2 citations73
US10050006B2Aug 14, 2018
Chip package and method for forming the same
XINTEC INC3 citations71
US9947716B2Apr 17, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations71
US9653422B2May 16, 2017
Chip package and method for forming the same
XINTEC INC2 citations71
US8748926B2Jun 10, 2014
Chip package with multiple spacers and method for forming the same
XINTEC INC4 citations70
US9881959B2Jan 30, 2018
Chip package and method of manufacturing the same
XINTEC INC1 citations52
US9640488B2May 2, 2017
Chip package and method for forming the same
XINTEC INC0 citations52
US9275958B2Mar 1, 2016
Chip package and method for forming the same
XINTEC INC1 citations52
US10109663B2Oct 23, 2018
Chip package and method for forming the same
XINTEC INC1 citations51
US9165890B2Oct 20, 2015
Chip package comprising alignment mark and method for forming the same
XINTEC INC1 citations51
US9875912B2Jan 23, 2018
Chip package and manufacturing method thereof
XINTEC INC0 citations49
US9426894B2Aug 23, 2016
Fabrication method of wiring structure for improving crown-like defect
XINTEC INC0 citations47
US9685354B2Jun 20, 2017
Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus
XINTEC INC0 citations42
US9236320B2Jan 12, 2016
Chip package
XINTEC INC0 citations42
US9711469B2Jul 18, 2017
Semiconductor structure having recess and manufacturing method thereof
XINTEC INC0 citations34
US8993365B2Mar 31, 2015
Wafer packaging method
XINTEC INC0 citations33
RAYNERGY TEK INC
12 patentsUS12433144B2Sep 30, 2025
Electrode connection structure and method of forming the same
RAYNERGY TEK INC0 citations62
US12396314B2Aug 19, 2025
Method of patterning a semiconductor layer
RAYNERGY TEK INC0 citations62
US12426493B2Sep 23, 2025
Structure of the photodiode
RAYNERGY TEK INC0 citations56
US12302682B2May 13, 2025
Structure of the photodiode
RAYNERGY TEK INC0 citations56
US12139465B2Nov 12, 2024
Non-fullerene acceptor compound containing benzoselenadiazole and organic optoelectronic device including the same
RAYNERGY TEK INC0 citations56
US11124662B2Sep 21, 2021
Polymer-polyoxometalate composite ink and application thereof
RAYNERGY TEK INC0 citations56
US10923666B1Feb 16, 2021
Hole transporting material, manufacturing method thereof, and organic photodiode thereof
RAYNERGY TEK INC0 citations56
US11903304B2Feb 13, 2024
Photodiode comprising fluropolymer compound
RAYNERGY TEK INC0 citations53
US12094996B2Sep 17, 2024
Electronic device and manufacturing method of the same
RAYNERGY TEK INC0 citations47
US11950491B2Apr 2, 2024
Semiconductor mixed material and application thereof
RAYNERGY TEK INC0 citations46
US11737351B2Aug 22, 2023
Organic semiconductor material and organic photoelectric device using the same
RAYNERGY TEK INC0 citations46
US11895918B2Feb 6, 2024
Organic semiconductor mixed material and organic photovolatic device using the same
RAYNERGY TEK INC0 citations45
IND TECH RES INST
4 patentsUS9356249B2May 31, 2016
Organic electronic device and electric field-induced carrier generation layer
IND TECH RES INST7 citations84
US9224790B2Dec 29, 2015
Illumination device
IND TECH RES INST2 citations62
US11051742B2Jul 6, 2021
Wearable device and respiration sensing module
IND TECH RES INST0 citations52
US9395072B2Jul 19, 2016
Illumination device
IND TECH RES INST0 citations51
CHANG YI-MING
2 patentsSHIU CHUAN-JIN
2 patentsUS8890191B2Nov 18, 2014
Chip package and method for forming the same
SHIU CHUAN-JIN13 citations81
US8785956B2Jul 22, 2014
Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same
SHIU CHUAN-JIN2 citations56