Inventor
SAKUYAMA SEIKI
JP47 patents
⚠️ This page may combine multiple inventors who share the name “SAKUYAMA SEIKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
42 patentsUS6580169B2Jun 17, 2003
Method for forming bumps, semiconductor device, and solder paste
FUJITSU LTD52 citations96
US6461953B1Oct 8, 2002
Solder bump forming method, electronic component mounting method, and electronic component mounting structure
FUJITSU LTD54 citations96
US5770835AJun 23, 1998
Process and apparatus and panel heater for soldering electronic components to printed circuit board
FUJITSU LTD51 citations96
US6518163B2Feb 11, 2003
Method for forming bumps, semiconductor device, and solder paste
FUJITSU LTD36 citations93
US6275750B1Aug 14, 2001
Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
FUJITSU LTD21 citations93
US5607609AMar 4, 1997
Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
FUJITSU LTD43 citations93
US7189927B2Mar 13, 2007
Electronic component with bump electrodes, and manufacturing method thereof
FUJITSU LTD29 citations92
US6689639B2Feb 10, 2004
Method of making semiconductor device
FUJITSU LTD30 citations92
US6670264B2Dec 30, 2003
Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
FUJITSU LTD26 citations92
US6630742B2Oct 7, 2003
Method for forming bumps, semiconductor device, and solder paste
FUJITSU LTD18 citations92
US6345757B1Feb 12, 2002
Reflow soldering method
FUJITSU LTD16 citations90
US6135344AOct 24, 2000
Reflow soldering method and a reflow soldering furnace
FUJITSU LTD34 citations90
US6524943B1Feb 25, 2003
Method of forming metal bumps
FUJITSU LTD16 citations84
US7119000B2Oct 10, 2006
Method of manufacturing semiconductor device
FUJITSU LTD10 citations74
US9402313B2Jul 26, 2016
Conductive material, conductive paste, circuit board, and semiconductor device
FUJITSU LTD5 citations73
US11057996B2Jul 6, 2021
Circuit board, method of manufacturing circuit board, and electronic device
FUJITSU LTD3 citations72
US10283434B2May 7, 2019
Electronic device, method for manufacturing the electronic device, and electronic apparatus
FUJITSU LTD2 citations72
US9137926B2Sep 15, 2015
Electronic device and method of manufacturing the same
FUJITSU LTD5 citations72
US7984841B2Jul 26, 2011
Member formed with coating film having tin as its main component, coating film forming method and soldering method
FUJITSU LTD4 citations63
US9462693B2Oct 4, 2016
Electronic device and method of manufacturing electronic device
FUJITSU LTD2 citations62
US9412715B2Aug 9, 2016
Semiconductor device, electronic device, and semiconductor device manufacturing method
FUJITSU LTD2 citations62
US9105600B2Aug 11, 2015
Sheet structure, method of manufacturing sheet structure, and electronic device
FUJITSU LTD3 citations62
US8740047B2Jun 3, 2014
Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
FUJITSU LTD2 citations62
US7743966B2Jun 29, 2010
Soldering flux and method for bonding semiconductor element
FUJITSU LTD3 citations62
US6873056B2Mar 29, 2005
Electrode-to-electrode bond structure
FUJITSU LTD3 citations62
US11114418B2Sep 7, 2021
Electronic device, method of manufacturing electronic device, and electronic apparatus
FUJITSU LTD0 citations52
US10167537B2Jan 1, 2019
Electronic apparatus and method for manufacturing the same
FUJITSU LTD0 citations52
US9831199B2Nov 28, 2017
Electronic device, electronic part, and solder
FUJITSU LTD0 citations52
US9831210B2Nov 28, 2017
Electronic device and electronic apparatus
FUJITSU LTD0 citations52
US9812418B2Nov 7, 2017
Electronic apparatus and method for fabricating the same
FUJITSU LTD0 citations52
US9761552B2Sep 12, 2017
Electronic apparatus and method for fabricating the same
FUJITSU LTD0 citations52
US9640508B2May 2, 2017
Electrical apparatus
FUJITSU LTD0 citations52
US9530745B2Dec 27, 2016
Electronic apparatus and method for fabricating the same
FUJITSU LTD0 citations52
US9490232B2Nov 8, 2016
Electronic apparatus and method for fabricating the same
FUJITSU LTD0 citations52
US8901751B2Dec 2, 2014
Semiconductor device, electronic device, and semiconductor device manufacturing method
FUJITSU LTD0 citations52
US7931760B2Apr 26, 2011
Whiskerless plated structure and plating method
FUJITSU LTD0 citations52
US7926696B2Apr 19, 2011
Composition
FUJITSU LTD0 citations52
US9620470B2Apr 11, 2017
Semiconductor device having connection terminal of solder
FUJITSU LTD0 citations51
US9305875B2Apr 5, 2016
Method of manufacturing semiconductor device capable of enhancing bonding strength between connection terminal and electrode
FUJITSU LTD1 citations51
US10062658B2Aug 28, 2018
Electronic component and electronic device
FUJITSU LTD0 citations49
US10056342B2Aug 21, 2018
Electronic component and electronic device
FUJITSU LTD0 citations49
US8952271B2Feb 10, 2015
Circuit board, semiconductor device, and method of manufacturing semiconductor device
FUJITSU LTD0 citations39