Inventor
KIM GU-SUNG
KR30 patents
⚠️ This page may combine multiple inventors who share the name “KIM GU-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
28 patentsUS7531890B2May 12, 2009
Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD239 citations99
US7276799B2Oct 2, 2007
Chip stack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD429 citations99
US7215033B2May 8, 2007
Wafer level stack structure for system-in-package and method thereof
SAMSUNG ELECTRONICS CO LTD422 citations99
US6908785B2Jun 21, 2005
Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD338 citations99
US5407864AApr 18, 1995
Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip
SAMSUNG ELECTRONICS CO LTD175 citations99
US7537959B2May 26, 2009
Chip stack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD52 citations98
US6607938B2Aug 19, 2003
Wafer level stack chip package and method for manufacturing same
SAMSUNG ELECTRONICS CO LTD394 citations98
US5356838AOct 18, 1994
Manufacturing method of a semiconductor device
SAMSUNG ELECTRONICS CO LTD71 citations96
US6836018B2Dec 28, 2004
Wafer level package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD13 citations93
US6586275B2Jul 1, 2003
Wafer level package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD20 citations93
US6518675B2Feb 11, 2003
Wafer level package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD26 citations93
US8368231B2Feb 5, 2013
Chipstack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD12 citations92
US7196000B2Mar 27, 2007
Method for manufacturing a wafer level chip scale package
SAMSUNG ELECTRONICS CO LTD20 citations92
US7262475B2Aug 28, 2007
Image sensor device and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD30 citations91
US5568057AOct 22, 1996
Method for performing a burn-in test
SAMSUNG ELECTRONICS CO LTD27 citations89
US7977156B2Jul 12, 2011
Chipstack package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD11 citations84
US7307340B2Dec 11, 2007
Wafer-level electronic modules with integral connector contacts
SAMSUNG ELECTRONICS CO LTD11 citations84
US7224055B2May 29, 2007
Center pad type IC chip with jumpers, method of processing the same and multi chip package
SAMSUNG ELECTRONICS CO LTD11 citations84
US7141885B2Nov 28, 2006
Wafer level package with air pads and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD13 citations84
US7786594B2Aug 31, 2010
Wafer level stack structure for system-in-package and method thereof
SAMSUNG ELECTRONICS CO LTD5 citations74
US7300864B2Nov 27, 2007
Method for forming solder bump structure
SAMSUNG ELECTRONICS CO LTD9 citations74
US5621242AApr 15, 1997
Semiconductor package having support film formed on inner leads
SAMSUNG ELECTRONICS CO LTD14 citations73
US7824959B2Nov 2, 2010
Wafer level stack structure for system-in-package and method thereof
SAMSUNG ELECTRONICS CO LTD3 citations63
US7550317B2Jun 23, 2009
Method for manufacture of wafer level package with air pads
SAMSUNG ELECTRONICS CO LTD4 citations63
US7521657B2Apr 21, 2009
Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations62
US7375426B2May 20, 2008
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7534656B2May 19, 2009
Image sensor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD2 citations61
US7371614B2May 13, 2008
Image sensor device and methods thereof
SAMSUNG ELECTRONICS CO LTD2 citations59