P

Inventor

ROSSNAGEL STEPHEN M

US70 patents
⚠️ This page may combine multiple inventors who share the name “ROSSNAGEL STEPHEN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

35 patents
US7514705B2Apr 7, 2009

Phase change memory cell with limited switchable volume

IBM55 citations98
US7388273B2Jun 17, 2008

Reprogrammable fuse structure and method

IBM73 citations98
US6178082B1Jan 23, 2001

High temperature, conductive thin film diffusion barrier for ceramic/metal systems

IBM129 citations98
US4588490AMay 13, 1986

Hollow cathode enhanced magnetron sputter device

IBM133 citations96
US8003319B2Aug 23, 2011

Systems and methods for controlling position of charged polymer inside nanopore

IBM52 citations94
US7956463B2Jun 7, 2011

Large grain size conductive structure for narrow interconnect openings

IBM24 citations93
US4824544AApr 25, 1989

Large area cathode lift-off sputter deposition device

IBM143 citations93
US4633129ADec 30, 1986

Hollow cathode

IBM50 citations93
US7488967B2Feb 10, 2009

Structure for confining the switching current in phase memory (PCM) cells

IBM40 citations92
US7098537B2Aug 29, 2006

Interconnect structure diffusion barrier with high nitrogen content

IBM17 citations92
US5182230AJan 26, 1993

Laser methods for circuit repair on integrated circuits and substrates

IBM41 citations92
US7247946B2Jul 24, 2007

On-chip Cu interconnection using 1 to 5 nm thick metal cap

IBM35 citations91
US7074719B2Jul 11, 2006

ALD deposition of ruthenium

IBM36 citations87
US9285339B2Mar 15, 2016

DNA sequencing using multiple metal layer structure with different organic coatings forming different transient bondings to DNA

IBM5 citations84
US8680501B2Mar 25, 2014

Memory cell with post deposition method for regrowth of crystalline phase change material

IBM4 citations84
US8039250B2Oct 18, 2011

Piezoelectric-based nanopore device for the active control of the motion of polymers through the same

IBM7 citations84
US7960808B2Jun 14, 2011

Reprogrammable fuse structure and method

IBM8 citations84
US7211507B2May 1, 2007

PE-ALD of TaN diffusion barrier region on low-k materials

IBM15 citations84
US7186446B2Mar 6, 2007

Plasma enhanced ALD of tantalum nitride and bilayer

IBM13 citations84
US6210545B1Apr 3, 2001

Method for forming a perovskite thin film using a sputtering method with a fully oxidized perovskite target

IBM15 citations82
US6943097B2Sep 13, 2005

Atomic layer deposition of metallic contacts, gates and diffusion barriers

IBM8 citations74
US10323333B2Jun 18, 2019

Feedback control of dimensions in nanopore and nanofluidic devices

IBM1 citations73
US10316423B2Jun 11, 2019

Feedback control of dimensions in nanopore and nanofluidic devices

IBM1 citations73
US9853210B2Dec 26, 2017

Reduced process degradation of spin torque magnetoresistive random access memory

IBM2 citations73
US5171709ADec 15, 1992

Laser methods for circuit repair on integrated circuits and substrates

IBM15 citations72
US10943863B2Mar 9, 2021

Techniques to improve reliability in Cu interconnects using Cu intermetallics

IBM0 citations63
US8029716B2Oct 4, 2011

Amorphous nitride release layers for imprint lithography, and method of use

IBM6 citations63
US8017433B2Sep 13, 2011

Post deposition method for regrowth of crystalline phase change material

IBM3 citations63
US7998842B2Aug 16, 2011

Atomic layer deposition metallic contacts, gates and diffusion barriers

IBM2 citations63
US7951708B2May 31, 2011

Copper interconnect structure with amorphous tantalum iridium diffusion barrier

IBM5 citations63
US7901980B2Mar 8, 2011

Self-aligned in-contact phase change memory device

IBM3 citations63
US7378338B2May 27, 2008

Method of forming an interconnect structure diffusion barrier with high nitrogen content

IBM2 citations63
US11158506B2Oct 26, 2021

Self-aligned, over etched hard mask fabrication method and structure

IBM0 citations62
US11015258B2May 25, 2021

Feedback control of dimensions in nanopore and nanofluidic devices

IBM0 citations62
US7405153B2Jul 29, 2008

Method for direct electroplating of copper onto a non-copper plateable layer

IBM6 citations62

PENG HONGBO

4 patents

AFZALI-ARDAKANI ALI

3 patents

HAIGHT RICHARD A

2 patents

CABRAL JR CYRIL

1 patent

LUNG HSIANG-LAN

1 patent

CABRAL JR CRYIL

1 patent

HARRER STEFAN

1 patent

GLOBALFOUNDRIES INC

1 patent

COTTE JOHN M

1 patent

Showing the top 50 of 70 patents by PatentIndex Score.