Inventor
CALMIDI VARAPRASAD V
US13 patents
⚠️ This page may combine multiple inventors who share the name “CALMIDI VARAPRASAD V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ENDICOTT INTERCONNECT TECH INC
8 patentsUS7629684B2Dec 8, 2009
Adjustable thickness thermal interposer and electronic package utilizing same
ENDICOTT INTERCONNECT TECH INC20 citations92
US7510912B2Mar 31, 2009
Method of making wirebond electronic package with enhanced chip pad design
ENDICOTT INTERCONNECT TECH INC17 citations92
US7261466B2Aug 28, 2007
Imaging inspection apparatus with directional cooling
ENDICOTT INTERCONNECT TECH INC16 citations92
US7851906B2Dec 14, 2010
Flexible circuit electronic package with standoffs
ENDICOTT INTERCONNECT TECH INC19 citations83
US7510324B2Mar 31, 2009
Method of inspecting articles using imaging inspection apparatus with directional cooling
ENDICOTT INTERCONNECT TECH INC9 citations83
US7490984B2Feb 17, 2009
Method of making an imaging inspection apparatus with improved cooling
ENDICOTT INTERCONNECT TECH INC8 citations83
US7354197B2Apr 8, 2008
Imaging inspection apparatus with improved cooling
ENDICOTT INTERCONNECT TECH INC10 citations83
US7253518B2Aug 7, 2007
Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC2 citations62
IBM
5 patentsUS6665187B1Dec 16, 2003
Thermally enhanced lid for multichip modules
IBM108 citations97
US6665186B1Dec 16, 2003
Liquid metal thermal interface for an electronic module
IBM138 citations97
US7186590B2Mar 6, 2007
Thermally enhanced lid for multichip modules
IBM26 citations92
US6622786B1Sep 23, 2003
Heat sink structure with pyramidic and base-plate cut-outs
IBM45 citations92
US7183642B2Feb 27, 2007
Electronic package with thermally-enhanced lid
IBM0 citations51