P

Inventor

LEE JAE-CHANG

KR42 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAE-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

22 patents
US10298197B2May 21, 2019

Bulk acoustic wave resonator and method of manufacturing the same

SAMSUNG ELECTRO MECH13 citations84
US12184265B2Dec 31, 2024

Resonator package and method of manufacturing the same

SAMSUNG ELECTRO MECH3 citations75
US10541665B2Jan 21, 2020

BAW resonator and BAW filter for reducing harmonic distortion

SAMSUNG ELECTRO MECH3 citations73
US9705065B2Jul 11, 2017

Piezoelectric actuator

SAMSUNG ELECTRO MECH3 citations73
US11277113B2Mar 15, 2022

Bulk-acoustic wave resonator

SAMSUNG ELECTRO MECH3 citations72
US11171096B2Nov 9, 2021

Semiconductor package

SAMSUNG ELECTRO MECH2 citations72
US7695118B2Apr 13, 2010

Piezoelectric inkjet printhead and method of manufacturing the same

SAMSUNG ELECTRO MECH6 citations71
US7789493B2Sep 7, 2010

Method for manufacturing piezoelectric ink-jet printhead

SAMSUNG ELECTRO MECH3 citations63
US10903816B2Jan 26, 2021

Thin-film type package

SAMSUNG ELECTRO MECH0 citations62
US10790797B2Sep 29, 2020

Acoustic resonator and method of manufacturing the same

SAMSUNG ELECTRO MECH1 citations62
US10756700B2Aug 25, 2020

Bulk acoustic wave resonator device

SAMSUNG ELECTRO MECH1 citations62
US10367471B2Jul 30, 2019

Resonator package and method of manufacturing the same

SAMSUNG ELECTRO MECH1 citations62
US7703895B2Apr 27, 2010

Piezoelectric inkjet printhead and method of manufacturing the same

SAMSUNG ELECTRO MECH3 citations62
US7926910B2Apr 19, 2011

Nozzle plate for inkjet head and method of manufacturing the nozzle plate

SAMSUNG ELECTRO MECH4 citations61
US7682001B2Mar 23, 2010

Piezoelectric actuator inkjet head and method of forming the same

SAMSUNG ELECTRO MECH0 citations52
US11476832B2Oct 18, 2022

Bulk-acoustic resonator module

SAMSUNG ELECTRO MECH0 citations51
US10329142B2Jun 25, 2019

Wafer level package and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations51
US8037605B2Oct 18, 2011

Piezoelectric inkjet printhead and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations51
US7789496B2Sep 7, 2010

Piezoelectric inkjet printhead and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations51
US9033472B2May 19, 2015

Piezo actuator and inkjet print head assembly having the same

SAMSUNG ELECTRO MECH0 citations42
US9038464B2May 26, 2015

Angular velocity sensor

SAMSUNG ELECTRO MECH0 citations41
US7909438B2Mar 22, 2011

Piezo-electric type inkjet printhead

SAMSUNG ELECTRO MECH0 citations41

SAMSUNG ELECTRONICS CO LTD

7 patents

SAMSUNG CORNING PREC MAT CO

2 patents

CORNING INC

2 patents

LEE JAE CHANG

2 patents

LEE JAE-CHANG

2 patents

KANG SUNG-GYU

1 patent

LEE TAE KYUNG

1 patent

LEE TAE-KYUNG

1 patent

KOREA RES INST CHEMICAL TECH

1 patent

SHIN HYUN HO

1 patent