Inventor
MALDO TIBURCIO A
CN17 patents
⚠️ This page may combine multiple inventors who share the name “MALDO TIBURCIO A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD SEMICONDUCTOR
8 patentsUS8030743B2Oct 4, 2011
Semiconductor package with an embedded printed circuit board and stacked die
FAIRCHILD SEMICONDUCTOR8 citations84
US7902646B2Mar 8, 2011
Multiphase synchronous buck converter
FAIRCHILD SEMICONDUCTOR11 citations84
US7564124B2Jul 21, 2009
Semiconductor die package including stacked dice and heat sink structures
FAIRCHILD SEMICONDUCTOR13 citations79
US7808101B2Oct 5, 2010
3D smart power module
FAIRCHILD SEMICONDUCTOR6 citations73
US7586179B2Sep 8, 2009
Wireless semiconductor package for efficient heat dissipation
FAIRCHILD SEMICONDUCTOR4 citations59
US7696612B2Apr 13, 2010
Multiphase synchronous buck converter
FAIRCHILD SEMICONDUCTOR0 citations52
US7952204B2May 31, 2011
Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same
FAIRCHILD SEMICONDUCTOR0 citations42
US7821114B2Oct 26, 2010
Multiphase synchronous buck converter
FAIRCHILD SEMICONDUCTOR0 citations41
LIU YONG
4 patentsUS8088645B2Jan 3, 2012
3D smart power module
LIU YONG6 citations84
US8508025B2Aug 13, 2013
Folded leadframe multiple die package
LIU YONG4 citations62
US8426953B2Apr 23, 2013
Semiconductor package with an embedded printed circuit board and stacked die
LIU YONG2 citations62
US8198710B2Jun 12, 2012
Folded leadframe multiple die package
LIU YONG0 citations52
SEMICONDUCTOR COMPONENTS IND LLC
3 patentsUS12489080B2Dec 2, 2025
Flexible clip with aligner structure
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12074160B2Aug 27, 2024
Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11908826B2Feb 20, 2024
Flexible clip with aligner structure
SEMICONDUCTOR COMPONENTS IND LLC0 citations62