Inventor
OHNO TAKAO
JP30 patents
⚠️ This page may combine multiple inventors who share the name “OHNO TAKAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEIJIN LTD
8 patentsUS6428644B1Aug 6, 2002
Process and apparatus for producing a laminate for electronic parts
TEIJIN LTD16 citations82
US7407702B2Aug 5, 2008
Polymetaphenylene isophthalamide-based polymer porous film, process for its production and battery separator
TEIJIN LTD2 citations62
US11931700B2Mar 19, 2024
Substrate for liquid filter
TEIJIN LTD0 citations60
US12573652B2Mar 10, 2026
Substrate for composite membrane
TEIJIN LTD0 citations56
US11929531B2Mar 12, 2024
Composite membrane
TEIJIN LTD0 citations56
US11338252B2May 24, 2022
Substrate for liquid filter
TEIJIN LTD0 citations56
US11338250B2May 24, 2022
Substrate for liquid filter
TEIJIN LTD0 citations56
US11338251B2May 24, 2022
Substrate for liquid filter
TEIJIN LTD0 citations56
MITSUI PETROCHEMICAL IND
6 patentsUS4612148ASep 16, 1986
Process for producing stretched articles of ultrahigh-molecular-weight polyethylene
MITSUI PETROCHEMICAL IND71 citations95
US4545950AOct 8, 1985
Process for producing stretched articles of ultrahigh-molecular-weight polyethylene
MITSUI PETROCHEMICAL IND116 citations95
US4168361ASep 18, 1979
Random copolymer of propylene and 1-butene and process for its production
MITSUI PETROCHEMICAL IND46 citations92
US5674624AOct 7, 1997
Highly light-transmitting dust protective film, and dust protective member
MITSUI PETROCHEMICAL IND40 citations90
US5667726ASep 16, 1997
Highly light-transmitting dust protective film, process for preparation thereof and dust protective member
MITSUI PETROCHEMICAL IND8 citations71
US4830996AMay 16, 1989
Ferroelectric ceramics
MITSUI PETROCHEMICAL IND7 citations71
FUJITSU LTD
3 patentsUS6732911B2May 11, 2004
Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
FUJITSU LTD35 citations92
US7196418B2Mar 27, 2007
Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
FUJITSU LTD14 citations83
US6673654B2Jan 6, 2004
Method of manufacturing semiconductor device using heated conveyance member
FUJITSU LTD15 citations80