Inventor

LEE SANG YOUP

KR9 patents

⚠️ This page may combine multiple inventors who share the name “LEE SANG YOUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

2 patents

US7893527B2Feb 22, 2011

Semiconductor plastic package and fabricating method thereof

SAMSUNG ELECTRO MECH14 citations82

US8926714B2Jan 6, 2015

Heat dissipating substrate and method of manufacturing the same

SAMSUNG ELECTRO MECH0 citations50

SOHN KEUNG-JIN

2 patents

US8397378B2Mar 19, 2013

Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board

SOHN KEUNG-JIN2 citations56

US8450618B2May 28, 2013

Printed circuit board with reinforced thermoplastic resin layer

SOHN KEUNG-JIN0 citations46

SHIN JOON-SIK

1 patent

US8647926B2Feb 11, 2014

Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip

SHIN JOON-SIK4 citations68

PARK JUNG-HWAN

1 patent

US8499441B2Aug 6, 2013

Method of manufacturing a printed circuit board

PARK JUNG-HWAN2 citations60

SAMSUNG ELECTRONICS CO LTD

1 patent

US7451080B2Nov 11, 2008

Controlling apparatus and method for bit rate

SAMSUNG ELECTRONICS CO LTD3 citations60

LEE SANG YOUP

1 patent

US8704100B2Apr 22, 2014

Heat dissipating substrate and method of manufacturing the same

LEE SANG YOUP2 citations55

SOHN KEUNGJIN

1 patent

US8997340B2Apr 7, 2015

Method of manufacturing and insulating sheet

SOHN KEUNGJIN1 citations44