Inventor

BHAGAVAT MILIND S

US59 patents

⚠️ This page may combine multiple inventors who share the name “BHAGAVAT MILIND S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BHAGAVAT MILIND S

ADVANCED MICRO DEVICES INC

Bond pads for low temperature hybrid bonding

Integrated circuit module with integrated discrete devices

Scheme for enabling die reuse in 3D stacked products

Offset-aligned three-dimensional integrated circuit

Molded chip package with anchor structures

Semiconductor chip with reduced pitch conductive pillars

Integrated circuit package with integrated voltage regulator

Molded chip package with anchor structures

Circuit board with compact passive component arrangement

Integrated circuit module with integrated discrete devices

Hybrid bridged fanout chiplet connectivity

Multirow semiconductor chip connections

Molded die last chip combination

Multi-chip package with offset 3D structure

Die stacking for multi-tier 3D integration

Bond pads for low temperature hybrid bonding

Semiconductor chip with reduced pitch conductive pillars

Offset-aligned three-dimensional integrated circuit

Multi-RDL structure packages and methods of fabricating the same

Arrangement and thermal management of 3D stacked dies

Fan-out packages with warpage resistance

Fabricating active-bridge-coupled GPU chiplets

GPU chiplets using high bandwidth crosslinks

Fan-out package with reinforcing rivets

Integrated circuit package with integrated voltage regulator

Semiconductor chip with solder cap probe test pads

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

APPLE INC

Optical encoder with direction-dependent optical properties having an optically anisotropic region to produce a first and a second light distribution

Optical encoder with direction-dependent optical properties comprising a spindle having an array of surface features defining a concave contour along a first direction and a convex contour along a second direction

Watch with rotatable optical encoder having a spindle defining an array of alternating regions extending along an axial direction parallel to the axis of a shaft

Biometric sensor chip having distributed sensor and control circuitry

Biometric sensor chip having distributed sensor and control circuitry

Finger biometric sensor assembly including direct bonding interface and related methods

BHAGAVAT MILIND S

Molded die last chip combination

Molded chip combination

Multi-chip package with offset 3D structure

Multi-RDL structure packages and methods of fabricating the same

Flexural plate wave device for chip cooling

Methods of grinding semiconductor wafers having improved nanotopology

AGARWAL RAHUL

Die stacking for multi-tier 3D integration

Stacked dies and dummy components for improved thermal performance

3D stacked dies with disparate interconnect footprints

Fan-out package with multi-layer redistribution layer structure

MEMC ELECTRONIC MATERIALS

Method for assessing workpiece nanotopology using a double side wafer grinder

Double side wafer grinder and methods for assessing workpiece nanotopology

Double side wafer grinder and methods for assessing workpiece nanotopology

Method of estimating post-polishing waviness characteristics of a semiconductor wafer

BROADCOM CORP

Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections

WUU JOHN

Arrangement and thermal management of 3D stacked dies