Inventor
OSTRANDER STEVEN P
US33 patents
⚠️ This page may combine multiple inventors who share the name “OSTRANDER STEVEN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS7816785B2Oct 19, 2010
Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
IBM45 citations92
US7079393B2Jul 18, 2006
Fluidic cooling systems and methods for electronic components
IBM44 citations92
US6821026B2Nov 23, 2004
Redundant configurable VCSEL laser array optical light source
IBM21 citations92
US5545429AAug 13, 1996
Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
IBM25 citations92
US9366591B2Jun 14, 2016
Determining magnitude of compressive loading
IBM10 citations84
US7462294B2Dec 9, 2008
Enhanced thermal conducting formulations
IBM13 citations84
US9947598B1Apr 17, 2018
Determining crackstop strength of integrated circuit assembly at the wafer level
IBM3 citations73
US9601423B1Mar 21, 2017
Under die surface mounted electrical elements
IBM4 citations73
US8363404B2Jan 29, 2013
Implementing loading and heat removal for hub module assembly
IBM5 citations72
US6819813B2Nov 16, 2004
Optical land grid array interposer
IBM10 citations72
US11228124B1Jan 18, 2022
Connecting a component to a substrate by adhesion to an oxidized solder surface
IBM1 citations62
US11211262B2Dec 28, 2021
Electronic apparatus having inter-chip stiffener
IBM0 citations62
US10325830B1Jun 18, 2019
Multipart lid for a semiconductor package with multiple components
IBM1 citations62
US6827505B2Dec 7, 2004
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
IBM4 citations60
US7786579B2Aug 31, 2010
Apparatus for crack prevention in integrated circuit packages
IBM1 citations52
US6908025B2Jun 21, 2005
Preparing MCM hat for removal
IBM1 citations52
US9219051B2Dec 22, 2015
Laminate peripheral clamping to control microelectronic module BSM warpage
IBM1 citations45
UNIV ALFRED RES
6 patentsUS5660774AAug 26, 1997
Process for making a sintered body from ultra-fine superconductive particles
UNIV ALFRED RES30 citations91
US5523065AJun 4, 1996
Process for making ultra-fine barium titanate particles
UNIV ALFRED RES23 citations91
US5468427ANov 21, 1995
Process for making ultra-fine ceramic particles
UNIV ALFRED RES33 citations91
US5716565AFeb 10, 1998
Process for making ultra-fine stabilized zirconia particles
UNIV ALFRED RES28 citations89
US5660772AAug 26, 1997
Process for making ultra-fine barium hexaferrite particles
UNIV ALFRED RES14 citations72
US5660773AAug 26, 1997
Process for making ultra-fine yttrium-iron-garnet particles
UNIV ALFRED RES15 citations72