Inventor

KHAN REZAUR RAHMAN

US58 patents

⚠️ This page may combine multiple inventors who share the name “KHAN REZAUR RAHMAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KHAN REZAUR RAHMAN

BROADCOM CORP

Leadframe IC packages having top and bottom integrated heat spreaders

Interconnect structure and formation for package stacking of molded plastic area array package

Method of assembling a ball grid array package with patterned stiffener layer

Ball grid array package enhanced with a thermal and electrical connector

Semiconductor package with interface substrate having interposer

Lead frame-BGA package with enhanced thermal performance and I/O counts

Semiconductor package including an organic substrate and interposer having through-semiconductor vias

Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader

Integrated circuit package with etched leadframe for package-on-package interconnects

Low voltage drop and high thermal performance ball grid array package

Semiconductor package with a bridge interposer

Interposer package-on-package structure

Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections

Interposer package-on-package structure

Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding

Package 3D interconnection and method of making same

Magnetic-core three-dimensional (3D) inductors and packaging integration

Thermal interface material for integrated circuit package

Semiconductor package including interposer with through-semiconductor vias

Semiconductor package including a substrate and an interposer

Interface substrate with interposer

Ball grid array package having one or more stiffeners

ZHAO SAM ZIQUN

Thermal improvement for hotspots on dies in integrated circuit packages

Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding

Integrated circuit (IC) package stacking and IC packages formed by same

Semiconductor packages with integrated heat spreaders

Semiconductor package with integrated selectively conductive film interposer

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

System-in-package with integrated socket

Package 3D interconnection and method of making same

IC package sacrificial structures for crack propagation confinement

KHAN REZAUR RAHMAN

Organic interface substrate having interposer with through-semiconductor vias

Package 3D interconnection and method of making same

Interposer for die stacking in semiconductor packages and the method of making the same

Semiconductor interposer having a cavity for intra-interposer die

Integrated circuit package with etched leadframe for package-on-package interconnects

Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages

KARIKALAN SAMPATH K V

Semiconductor package with integrated electromagnetic shielding

Semiconductor package with a bridge interposer

Semiconductor package with ultra-thin interposer without through-semiconductor vias

AVAGO TECHNOLOGIES GENERAL IP

Thin recon interposer package without TSV for fine input/output pitch fan-out

Heat spreader having thermal interface material retainment

LAW EDWARD

Multi-chip and multi-substrate reconstitution based packaging

Low profile ball grid array (BGA) package with exposed die and method of making same

KARIKALAN SAMPATH KOMARAPALAYAM VELAYUDHAM

Mutual capacitance and magnetic field distribution control for transmission lines

Mutual capacitance and magnetic field distribution control for transmission lines

GOMEZ RAY RAMON

Wideband power efficient high transmission power radio frequency (RF) transmitter

AVAGO TECH INT SALES PTE LID

Thin recon interposer package without TSV for fine input/output pitch fan-out

CHEN XIANGDONG

Semiconductor package having an interposer configured for magnetic signaling

AVAGO TECH INTERNATIONAL SALES PE LIMITED

High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer