Inventor
Singh Akhilesh Kumar
US5 patents
⚠️ This page may combine multiple inventors who share the name “Singh Akhilesh Kumar”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
4 patentsUS11189557B2Nov 30, 2021
Hybrid package
NXP USA INC0 citations59
US11270972B2Mar 8, 2022
Package with conductive underfill ground plane
NXP USA INC0 citations49
US11908784B2Feb 20, 2024
Packaged semiconductor device assembly
NXP USA INC0 citations46
US10431534B2Oct 1, 2019
Package with support structure
NXP USA INC0 citations45