P

Inventor

HUANG TIEN-YU

TW24 patents
⚠️ This page may combine multiple inventors who share the name “HUANG TIEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

16 patents
US10267988B2Apr 23, 2019

Photonic package and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93
US9419156B2Aug 16, 2016

Package and method for integration of heterogeneous integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10459159B2Oct 29, 2019

Photonic package and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11694939B2Jul 4, 2023

Semiconductor package, integrated optical communication system

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10748825B2Aug 18, 2020

Package and method for integration of heterogeneous integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276471B2Apr 30, 2019

Package and method for integration of heterogeneous integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9902092B2Feb 27, 2018

Vacuum carrier module, method of using and process of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9478475B2Oct 25, 2016

Apparatus and package structure of optical chip

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11764123B2Sep 19, 2023

Semiconductor package, integrated optical communication system

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11150404B2Oct 19, 2021

Photonic package and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12124078B2Oct 22, 2024

Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11243353B2Feb 8, 2022

Semiconductor device and method of manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10527791B2Jan 7, 2020

Semiconductor device and method of manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10137603B2Nov 27, 2018

Vacuum carrier module, method of using and process of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9865481B2Jan 9, 2018

Package and method for integration of heterogeneous integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9799528B2Oct 24, 2017

Apparatus and package structure of optical chip

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

TAIWAN SEMICONDUCTOR MFG

3 patents

Orange Hardware Company

2 patents

(unassigned)

1 patent

HACKSAW & KNIFE MANUFACTORY CO LTD

1 patent

UNIV FLORIDA

1 patent