Inventor
HUANG TIEN-YU
TW24 patents
⚠️ This page may combine multiple inventors who share the name “HUANG TIEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS10267988B2Apr 23, 2019
Photonic package and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD24 citations93
US9419156B2Aug 16, 2016
Package and method for integration of heterogeneous integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10459159B2Oct 29, 2019
Photonic package and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11694939B2Jul 4, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10748825B2Aug 18, 2020
Package and method for integration of heterogeneous integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10276471B2Apr 30, 2019
Package and method for integration of heterogeneous integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9902092B2Feb 27, 2018
Vacuum carrier module, method of using and process of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9478475B2Oct 25, 2016
Apparatus and package structure of optical chip
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11764123B2Sep 19, 2023
Semiconductor package, integrated optical communication system
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11150404B2Oct 19, 2021
Photonic package and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US12124078B2Oct 22, 2024
Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11243353B2Feb 8, 2022
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10527791B2Jan 7, 2020
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10137603B2Nov 27, 2018
Vacuum carrier module, method of using and process of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9865481B2Jan 9, 2018
Package and method for integration of heterogeneous integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9799528B2Oct 24, 2017
Apparatus and package structure of optical chip
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
3 patentsUS9099623B2Aug 4, 2015
Manufacture including substrate and package structure of optical chip
TAIWAN SEMICONDUCTOR MFG3 citations63
US9354390B2May 31, 2016
Semiconductor device and method of manufacturing
TAIWAN SEMICONDUCTOR MFG0 citations52
US9264569B2Feb 16, 2016
Optical scanner integrated with substrate method of making and method of using the same
TAIWAN SEMICONDUCTOR MFG0 citations52