Inventor
TSUCHIYA MASATO
JP25 patents
⚠️ This page may combine multiple inventors who share the name “TSUCHIYA MASATO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CANON KK
7 patentsUS11438469B2Sep 6, 2022
Wireless terminal, management server and intention interpretation server
CANON KK2 citations72
US10264148B2Apr 16, 2019
Information processing apparatus, control method, and storage medium storing program
CANON KK2 citations72
US11340849B2May 24, 2022
Information processing apparatus, information processing method, and storage medium, that include a wireless connection request blocking feature
CANON KK0 citations62
US10732911B2Aug 4, 2020
Information processing apparatus, information processing method, and storage medium, that include a wireless connection request blocking feature
CANON KK0 citations51
US10708454B2Jul 7, 2020
Information processing apparatus, control method, and storage medium storing program
CANON KK0 citations51
US10666833B2May 26, 2020
Information processing apparatus, method of controlling the same, and storage medium, for controlling wireless communications of a first communication function and a second communication function
CANON KK0 citations51
US10218876B2Feb 26, 2019
Information processing apparatus, method of controlling the same, and storage medium
CANON KK0 citations51
SENJU METAL INDUSTRY CO
6 patentsUS10639749B2May 5, 2020
Cu core ball, solder joint, solder paste and formed solder
SENJU METAL INDUSTRY CO2 citations71
US12080671B2Sep 3, 2024
Layered bonding material, semiconductor package, and power module
SENJU METAL INDUSTRY CO0 citations60
US11495566B2Nov 8, 2022
Core material, electronic component and method for forming bump electrode
SENJU METAL INDUSTRY CO1 citations60
US10888959B2Jan 12, 2021
Cu core ball, solder joint, solder paste and formed solder
SENJU METAL INDUSTRY CO0 citations60
US11712760B2Aug 1, 2023
Layered bonding material, semiconductor package, and power module
SENJU METAL INDUSTRY CO0 citations50
US11872656B2Jan 16, 2024
Core material, electronic component and method for forming bump electrode
SENJU METAL INDUSTRY CO0 citations49
NEC PLATFORMS LTD
5 patentsUS12212061B2Jan 28, 2025
Antenna apparatus
NEC PLATFORMS LTD0 citations62
US12027784B2Jul 2, 2024
Antenna device
NEC PLATFORMS LTD0 citations55
US12230864B2Feb 18, 2025
Wireless apparatus
NEC PLATFORMS LTD0 citations51
US12119571B2Oct 15, 2024
Antenna device
NEC PLATFORMS LTD0 citations51
US12244057B2Mar 4, 2025
Antenna device
NEC PLATFORMS LTD0 citations40
MIMASU SEMICONDUCTOR IND CO
4 patentsUS6810888B2Nov 2, 2004
Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
MIMASU SEMICONDUCTOR IND CO49 citations91
US6672318B1Jan 6, 2004
Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism
MIMASU SEMICONDUCTOR IND CO51 citations91
US7659212B2Feb 9, 2010
Process control method in spin etching and spin etching apparatus
MIMASU SEMICONDUCTOR IND CO8 citations79
US7364616B2Apr 29, 2008
Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
MIMASU SEMICONDUCTOR IND CO11 citations79