Inventor
AWAKURA YASUTAKA
JP2 patents
Patents
2 patentsUS10392310B2Aug 27, 2019
Porous plate-shaped filler aggregate, producing method therefor, and heat-insulation film containing porous plate-shaped filler aggregate
NGK INSULATORS LTD0 citations47
US10784182B2Sep 22, 2020
Bonded substrate and method for manufacturing bonded substrate
NGK INSULATORS LTD0 citations46