Inventor
HOECHBAUER TOBIAS FRANZ WOLFGANG
AT8 patents
Patents
8 patentsUS10903078B2Jan 26, 2021
Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device
INFINEON TECHNOLOGIES AG9 citations84
US11476111B2Oct 18, 2022
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
INFINEON TECHNOLOGIES AG2 citations72
US11107732B2Aug 31, 2021
Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers
INFINEON TECHNOLOGIES AG2 citations72
US11373863B2Jun 28, 2022
Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate
INFINEON TECHNOLOGIES AG3 citations71
US12412740B2Sep 9, 2025
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
INFINEON TECHNOLOGIES AG0 citations62
US11881397B2Jan 23, 2024
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device
INFINEON TECHNOLOGIES AG0 citations62
US11576259B2Feb 7, 2023
Carrier, laminate and method of manufacturing semiconductor devices
INFINEON TECHNOLOGIES AG0 citations61
US11557506B2Jan 17, 2023
Methods for processing a semiconductor substrate
INFINEON TECHNOLOGIES AG0 citations60