Inventor
RINNE GLENN
US27 patents
⚠️ This page may combine multiple inventors who share the name “RINNE GLENN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
17 patentsUS9490231B2Nov 8, 2016
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC14 citations92
US10410993B2Sep 10, 2019
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC4 citations84
US10056349B2Aug 21, 2018
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC5 citations84
US9837376B2Dec 5, 2017
Manufacturing method of semiconductor device and semiconductor device thereof
AMKOR TECHNOLOGY INC4 citations84
US9627368B2Apr 18, 2017
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECHNOLOGY INC11 citations84
US10304697B2May 28, 2019
Electronic device with top side pin array and manufacturing method thereof
AMKOR TECHNOLOGY INC6 citations82
US10734343B2Aug 4, 2020
Method and system for packing optimization of semiconductor devices
AMKOR TECHNOLOGY INC1 citations73
US10388643B2Aug 20, 2019
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECHNOLOGY INC2 citations73
US9978644B1May 22, 2018
Semiconductor device and manufacturing method
AMKOR TECHNOLOGY INC6 citations73
US10832921B2Nov 10, 2020
Electronic device with top side pin array and manufacturing method thereof
AMKOR TECHNOLOGY INC1 citations71
US9875980B2Jan 23, 2018
Copper pillar sidewall protection
AMKOR TECHNOLOGY INC6 citations71
US9412729B2Aug 9, 2016
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC2 citations63
US9406639B2Aug 2, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations63
US10115705B2Oct 30, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US9865565B2Jan 9, 2018
Transient interface gradient bonding for metal bonds
AMKOR TECHNOLOGY INC1 citations52
US10157872B2Dec 18, 2018
Semiconductor device and method of manufacturing thereof
AMKOR TECHNOLOGY INC0 citations49
US10037957B2Jul 31, 2018
Semiconductor device and method of manufacturing thereof
AMKOR TECHNOLOGY INC0 citations49
AMKOR TECH SINGAPORE HOLDING PTE LTD
7 patentsUS12362343B2Jul 15, 2025
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12327812B2Jun 10, 2025
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11916033B2Feb 27, 2024
Method and system for packing optimization of semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11901332B2Feb 13, 2024
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11183493B2Nov 23, 2021
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11031370B2Jun 8, 2021
Semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12205827B2Jan 21, 2025
Electronic device with top side pin array and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60