Inventor

SOHN YOUNGHOON

KR21 patents

⚠️ This page may combine multiple inventors who share the name “SOHN YOUNGHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SOHN YOUNGHOON

SAMSUNG ELECTRONICS CO LTD

Vibration isolation table for semiconductor equipment and vibration isolation table system including the same

Substrate inspection method and method of fabricating a semiconductor device using the same

Light detection and ranging (LiDAR)-based inspection device and method of manufacturing semiconductor device

Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor device

Method of inspecting semiconductor wafer, inspection system for performing the same, and method of fabricating semiconductor device using the same

Terahertz signal measuring apparatus and measuring method

Optical module, spectroscopic device for hyperspectral imaging, and imaging measurement method using the same

Apparatus and method for measuring a layer of a semiconductor device using x-ray diffraction

Spectroscopic device, spectroscopic method using the same, and method of fabricating semiconductor memory device using the same

Inspection method, inspection system, and method of manufacturing semiconductor package using the same

Wafer inspection apparatus using three-dimensional image and method of inspecting wafer using the same

Measurement apparatus and measurement method using the same

Dual resolution spectrometer, and spectrometric measurement apparatus and method using the spectrometer

Inspection method, inspection system, and method of fabricating semiconductor package using the same

Method of operating scanning electron microscope (SEM) and method of manufacturing semiconductor device using the same

Test apparatus and test method thereof

Method and system for inspecting semiconductor wafer and method of fabricating semiconductor device using the same

Method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated thereby

Fan-out panel level package and method of fabricating the same

Apparatus and method for measuring thickness

PARK MIRA

Methods and apparatuses for inspecting semiconductor devices using electron beams