Inventor
YANG YUSIN
KR19 patents
⚠️ This page may combine multiple inventors who share the name “YANG YUSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS9466537B2Oct 11, 2016
Method of inspecting semiconductor device and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD5 citations70
US9583402B2Feb 28, 2017
Method of manufacturing a semiconductor device using semiconductor measurement system
SAMSUNG ELECTRONICS CO LTD2 citations68
US10393672B2Aug 27, 2019
System and method of inspecting substrate and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD2 citations64
US11486834B2Nov 1, 2022
Substrate inspection method and method of fabricating a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12578467B2Mar 17, 2026
Light detection and ranging (LiDAR)-based inspection device and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US12385946B2Aug 12, 2025
Method of inspecting tip of atomic force microscope and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations58
US11004712B2May 11, 2021
Method of inspecting semiconductor wafer, inspection system for performing the same, and method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD1 citations58
US12474260B2Nov 18, 2025
Terahertz signal measuring apparatus and measuring method
SAMSUNG ELECTRONICS CO LTD0 citations57
US10845232B2Nov 24, 2020
Mass flow controller, apparatus for manufacturing semiconductor device, and method for maintenance thereof
SAMSUNG ELECTRONICS CO LTD0 citations51
US10482593B2Nov 19, 2019
Inspection method, inspection system, and method of manufacturing semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12590900B2Mar 31, 2026
Wafer inspection apparatus using three-dimensional image and method of inspecting wafer using the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US10460436B2Oct 29, 2019
Inspection method, inspection system, and method of fabricating semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD0 citations48
US12092656B2Sep 17, 2024
Test apparatus and test method thereof
SAMSUNG ELECTRONICS CO LTD0 citations47
US10269111B2Apr 23, 2019
Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations44
US10720365B2Jul 21, 2020
Method of measuring misalignment of chips, a method of fabricating a fan-out panel level package using the same, and a fan-out panel level package fabricated thereby
SAMSUNG ELECTRONICS CO LTD0 citations40
US9892980B2Feb 13, 2018
Fan-out panel level package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations40
US10088297B2Oct 2, 2018
Apparatus and method for measuring thickness
SAMSUNG ELECTRONICS CO LTD0 citations36