Inventor

LEE KI WOOK

KR48 patents

⚠️ This page may combine multiple inventors who share the name “LEE KI WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KI WOOK

THINKWARE CORP

Apparatus, method, computer program, and computer readable recording medium for route guidance

Device, method, computer program, and computer readable-recording medium for route guidance

Apparatus, method, computer program, and computer readable recording medium for route guidance

Device, method, computer program, and computer readable-recording medium for route guidance

Image processing apparatus, image processing method, computer program and computer readable recording medium

Image processing apparatus, image processing method, computer program and computer readable recording medium

Apparatus, method, computer program, and computer readable recording medium for route guidance

Image processing apparatus, image processing method, computer program and computer readable recording medium

Image processing apparatus, image processing method, computer program and computer readable recording medium

Method and apparatus for generating road surface, method and apparatus for processing point cloud data, computer program, and computer readable recording medium

Device, method, computer program, and computer-readable recording medium for route guidance

Image processing apparatus, image processing method, computer program and computer readable recording medium

Image processing apparatus, image processing method, computer program and computer readable recording medium

Apparatus, method, user terminal apparatus, program, and computer readable recording medium for measuring position of moving object

AMKOR TECHNOLOGY INC

Exposed die overmolded flip chip package and fabrication method

Carrier frame and semiconductor package including carrier frame

Semiconductor devices and fabrication methods thereof

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package

Semiconductor package and fabrication method thereof

Thermally enhanced semiconductor package

Semiconductor device

Semiconductor device with through-mold via

SKYWORKS SOLUTIONS INC

Method of making printed circuit board structure including a closed cavity with vias

Method of making printed circuit board structure including a closed cavity

Printed circuit board structure including a closed cavity

Printed circuit board structure including a closed cavity

Method of making a closed cavity printed circuit board with patterned laminate structure

Printed circuit board structure including a closed cavity

Method of manufacturing a radio-frequency module with a conformal shield antenna

Electronic package and method for manufacturing an electronic package

Application of conductive via or trench for intra module EMI shielding

Closed-cavity printed circuit board

Devices and methods related to nested filters

LG ELECTRONICS INC

Apparatus for controlling motor and method for controlling motor

Apparatus for controlling motor and method for controlling motor

Apparatus for controlling motor and method for controlling motor

Apparatus for controlling motor and method for controlling motor

LMS CO LTD

Optical sheet and backlight unit having same

Optical sheet module and backlight unit having same

Optical sheet assembly and backlight unit comprising same

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor device with through-mold via

Semiconductor device with through-mold via

KOREA ELECTROTECH RES INST

Electric power converting device and power converting method for controlling doubly-fed induction generator

KOREAN ELECTRO TECHNOLOGY RES

Controller of doubly-fed induction generator

DARVEAUX ROBERT FRANCIS

Exposed die overmolded flip chip package method