Inventor
KUKANSKIS PETER E
US20 patents
Patents
20 patentsUS4265943AMay 5, 1981
Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
MACDERMID INC338 citations97
US4921571AMay 1, 1990
Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
MACDERMID INC42 citations92
US4608275AAug 26, 1986
Oxidizing accelerator
MACDERMID INC43 citations92
US4976990ADec 11, 1990
Process for metallizing non-conductive substrates
MACDERMID INC65 citations91
US4597988AJul 1, 1986
Process for preparing printed circuit board thru-holes
MACDERMID INC40 citations91
US4279948AJul 21, 1981
Electroless copper deposition solution using a hypophosphite reducing agent
MACDERMID INC44 citations91
US4209331AJun 24, 1980
Electroless copper composition solution using a hypophosphite reducing agent
MACDERMID INC49 citations91
US5132038AJul 21, 1992
Composition for preparing printed circuit through-holes for metallization
MACDERMID INC25 citations89
US5032427AJul 16, 1991
Process for preparation printed circuit through-holes for metallization
MACDERMID INC25 citations89
US4931148AJun 5, 1990
Method for manufacture of printed circuit boards
MACDERMID INC46 citations87
US5037482AAug 6, 1991
Composition and method for improving adhesion of coatings to copper surfaces
MACDERMID INC27 citations86
US3982045ASep 21, 1976
Method of manufacture of additive printed circuitboards using permanent resist mask
MACDERMID INC30 citations82
US4756930AJul 12, 1988
Process for preparing printed circuit board thru-holes
MACDERMID INC21 citations80
US3959523AMay 25, 1976
Additive printed circuit boards and method of manufacture
MACDERMID INC30 citations80
US5376189ADec 27, 1994
Composition and process for treatment of metallic surfaces
MACDERMID INC16 citations74
US4735694AApr 5, 1988
Method for manufacture of printed circuit boards
MACDERMID INC10 citations74
US4459184AJul 10, 1984
Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
MACDERMID INC7 citations74
US5213840AMay 25, 1993
Method for improving adhesion to polymide surfaces
MACDERMID INC13 citations71
US4938853AJul 3, 1990
Electrolytic method for the dissolution of copper particles formed during electroless copper deposition
MACDERMID INC9 citations71
US5077099ADec 31, 1991
Electroless copper plating process and apparatus
MACDERMID INC17 citations67