Inventor
RHODENIZER HAROLD L
US4 patents
Patents
4 patentsUS4863758ASep 5, 1989
Catalyst solutions for activating non-conductive substrates and electroless plating process
MACDERMID INC52 citations93
US4597988AJul 1, 1986
Process for preparing printed circuit board thru-holes
MACDERMID INC40 citations91
US4110147AAug 29, 1978
Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits
MACDERMID INC35 citations89
US4756930AJul 12, 1988
Process for preparing printed circuit board thru-holes
MACDERMID INC21 citations80