Inventor
PAPATHOMAS KOSTAS
US29 patents
⚠️ This page may combine multiple inventors who share the name “PAPATHOMAS KOSTAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS6178093B1Jan 23, 2001
Information handling system with circuit assembly having holes filled with filler material
IBM168 citations99
US5822856AOct 20, 1998
Manufacturing circuit board assemblies having filled vias
IBM223 citations99
US6323436B1Nov 27, 2001
High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
IBM156 citations97
US5194930AMar 16, 1993
Dielectric composition and solder interconnection structure for its use
IBM143 citations97
US6138350AOct 31, 2000
Process for manufacturing a circuit board with filled holes
IBM37 citations96
US6000129ADec 14, 1999
Process for manufacturing a circuit with filled holes
IBM43 citations96
US6106891AAug 22, 2000
Via fill compositions for direct attach of devices and method for applying same
IBM38 citations95
US6207595B1Mar 27, 2001
Laminate and method of manufacture thereof
IBM59 citations93
US5268260ADec 7, 1993
Photoresist develop and strip solvent compositions and method for their use
IBM102 citations93
US6555762B2Apr 29, 2003
Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition
IBM38 citations92
US6127025AOct 3, 2000
Circuit board with wiring sealing filled holes
IBM23 citations92
US6066889AMay 23, 2000
Methods of selectively filling apertures
IBM30 citations92
US5863332AJan 26, 1999
Fluid jet impregnating and coating device with thickness control capability
IBM26 citations92
US5766670AJun 16, 1998
Via fill compositions for direct attach of devices and methods for applying same
IBM39 citations92
US5713508AFeb 3, 1998
Stabilization of conductive adhesive by metallurgical bonding
IBM29 citations92
US5571593ANov 5, 1996
Via fill compositions for direct attach of devices and methods for applying same
IBM53 citations92
US5542602AAug 6, 1996
Stabilization of conductive adhesive by metallurgical bonding
IBM40 citations92
US5887345AMar 30, 1999
Method for applying curable fill compositon to apertures in a substrate
IBM21 citations90
US6127097AOct 3, 2000
Photoresist develop and strip solvent compositions and method for their use
IBM27 citations89
US6114019ASep 5, 2000
Circuit board assemblies having filled vias free from bleed-out
IBM13 citations82
US6376158B1Apr 23, 2002
Methods for selectively filling apertures
IBM11 citations73
US6134772AOct 24, 2000
Via fill compositions for direct attach of devices and methods of applying same
IBM3 citations62
US5143756ASep 1, 1992
Fiber reinforced epoxy prepreg and fabrication thereof
IBM6 citations60
ENDICOTT INTERCONNECT TECH INC
4 patentsUS7508076B2Mar 24, 2009
Information handling system including a circuitized substrate having a dielectric layer without continuous fibers
ENDICOTT INTERCONNECT TECH INC56 citations96
US7270845B2Sep 18, 2007
Dielectric composition for forming dielectric layer for use in circuitized substrates
ENDICOTT INTERCONNECT TECH INC19 citations91
US7078816B2Jul 18, 2006
Circuitized substrate
ENDICOTT INTERCONNECT TECH INC23 citations91
US7416996B2Aug 26, 2008
Method of making circuitized substrate
ENDICOTT INTERCONNECT TECH INC7 citations72