P

Inventor

HSIEH WEN-YI

TW92 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH WEN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

30 patents
US6174812B1Jan 16, 2001

Copper damascene technology for ultra large scale integration circuits

UNITED MICROELECTRONICS CORP405 citations98
US6078492AJun 20, 2000

Structure of a capacitor in a semiconductor device having a self align contact window which has a slanted sidewall

UNITED MICROELECTRONICS CORP62 citations96
US5994181ANov 30, 1999

Method for forming a DRAM cell electrode

UNITED MICROELECTRONICS CORP57 citations96
US6046097AApr 4, 2000

Deposition method with improved step coverage

UNITED MICROELECTRONICS CORP57 citations95
US6339025B1Jan 15, 2002

Method of fabricating a copper capping layer

UNITED MICROELECTRONICS CORP33 citations93
US6228709B1May 8, 2001

Method of fabricating hemispherical grain electrode

UNITED MICROELECTRONICS CORP22 citations93
US6218284B1Apr 17, 2001

Method for forming an inter-metal dielectric layer

UNITED MICROELECTRONICS CORP24 citations93
US6156600ADec 5, 2000

Method for fabricating capacitor in integrated circuit

UNITED MICROELECTRONICS CORP26 citations93
US6146941ANov 14, 2000

Method for fabricating a capacitor in a semiconductor device

UNITED MICROELECTRONICS CORP21 citations93
US5994183ANov 30, 1999

Method for forming charge storage structure

UNITED MICROELECTRONICS CORP49 citations93
US6251779B1Jun 26, 2001

Method of forming a self-aligned silicide on a semiconductor wafer

UNITED MICROELECTRONICS CORP28 citations92
US6169028B1Jan 2, 2001

Method fabricating metal interconnected structure

UNITED MICROELECTRONICS CORP34 citations92
US6048788AApr 11, 2000

Method of fabricating metal plug

UNITED MICROELECTRONICS CORP33 citations92
US6022795AFeb 8, 2000

Salicide formation process

UNITED MICROELECTRONICS CORP23 citations92
US6316323B1Nov 13, 2001

Method for forming bridge free silicide by reverse spacer

UNITED MICROELECTRONICS CORP25 citations91
US6238989B1May 29, 2001

Process of forming self-aligned silicide on source/drain region

UNITED MICROELECTRONICS CORP40 citations87
US6277736B1Aug 21, 2001

Method for forming gate

UNITED MICROELECTRONICS CORP19 citations86
US6080660AJun 27, 2000

Via structure and method of manufacture

UNITED MICROELECTRONICS CORP16 citations84
US6251711B1Jun 26, 2001

Method for forming bridge free silicide

UNITED MICROELECTRONICS CORP15 citations83
US6479344B2Nov 12, 2002

Method of fabricating DRAM capacitor

UNITED MICROELECTRONICS CORP8 citations74
US6245380B1Jun 12, 2001

Method of forming bonding pad

UNITED MICROELECTRONICS CORP10 citations74
US6218238B1Apr 17, 2001

Method of fabricating DRAM capacitor

UNITED MICROELECTRONICS CORP9 citations74
US6180451B1Jan 30, 2001

Method of forming capacitor with a HSG layer

UNITED MICROELECTRONICS CORP7 citations74
US6083789AJul 4, 2000

Method for manufacturing DRAM capacitor

UNITED MICROELECTRONICS CORP9 citations74
US6057189AMay 2, 2000

Method of fabricating capacitor utilizing an ion implantation method

UNITED MICROELECTRONICS CORP9 citations74
US6048796AApr 11, 2000

Method of manufacturing multilevel metal interconnect

UNITED MICROELECTRONICS CORP12 citations74
US6287967B1Sep 11, 2001

Self-aligned silicide process

UNITED MICROELECTRONICS CORP14 citations73
US6146742ANov 14, 2000

Barrier/glue layer on polysilicon layer

UNITED MICROELECTRONICS CORP12 citations73
US5897373AApr 27, 1999

Method of manufacturing semiconductor components having a titanium nitride layer

UNITED MICROELECTRONICS CORP7 citations73
US6255177B1Jul 3, 2001

Method for fabricating a salicide gate

UNITED MICROELECTRONICS CORP13 citations72

HON HAI PREC IND CO LTD

14 patents

CHANG YEN-CHIH

2 patents

FOXCONN INTERCONNECT TECHNOLOGY LTD

2 patents

MACRONIX INT CO LTD

1 patent

HSIEH WEN-YI

1 patent

Showing the top 50 of 92 patents by PatentIndex Score.