Inventor
HSIEH WEN-YI
TW92 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH WEN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
30 patentsUS6174812B1Jan 16, 2001
Copper damascene technology for ultra large scale integration circuits
UNITED MICROELECTRONICS CORP405 citations98
US6078492AJun 20, 2000
Structure of a capacitor in a semiconductor device having a self align contact window which has a slanted sidewall
UNITED MICROELECTRONICS CORP62 citations96
US5994181ANov 30, 1999
Method for forming a DRAM cell electrode
UNITED MICROELECTRONICS CORP57 citations96
US6046097AApr 4, 2000
Deposition method with improved step coverage
UNITED MICROELECTRONICS CORP57 citations95
US6339025B1Jan 15, 2002
Method of fabricating a copper capping layer
UNITED MICROELECTRONICS CORP33 citations93
US6228709B1May 8, 2001
Method of fabricating hemispherical grain electrode
UNITED MICROELECTRONICS CORP22 citations93
US6218284B1Apr 17, 2001
Method for forming an inter-metal dielectric layer
UNITED MICROELECTRONICS CORP24 citations93
US6156600ADec 5, 2000
Method for fabricating capacitor in integrated circuit
UNITED MICROELECTRONICS CORP26 citations93
US6146941ANov 14, 2000
Method for fabricating a capacitor in a semiconductor device
UNITED MICROELECTRONICS CORP21 citations93
US5994183ANov 30, 1999
Method for forming charge storage structure
UNITED MICROELECTRONICS CORP49 citations93
US6251779B1Jun 26, 2001
Method of forming a self-aligned silicide on a semiconductor wafer
UNITED MICROELECTRONICS CORP28 citations92
US6169028B1Jan 2, 2001
Method fabricating metal interconnected structure
UNITED MICROELECTRONICS CORP34 citations92
US6048788AApr 11, 2000
Method of fabricating metal plug
UNITED MICROELECTRONICS CORP33 citations92
US6022795AFeb 8, 2000
Salicide formation process
UNITED MICROELECTRONICS CORP23 citations92
US6316323B1Nov 13, 2001
Method for forming bridge free silicide by reverse spacer
UNITED MICROELECTRONICS CORP25 citations91
US6238989B1May 29, 2001
Process of forming self-aligned silicide on source/drain region
UNITED MICROELECTRONICS CORP40 citations87
US6277736B1Aug 21, 2001
Method for forming gate
UNITED MICROELECTRONICS CORP19 citations86
US6080660AJun 27, 2000
Via structure and method of manufacture
UNITED MICROELECTRONICS CORP16 citations84
US6251711B1Jun 26, 2001
Method for forming bridge free silicide
UNITED MICROELECTRONICS CORP15 citations83
US6479344B2Nov 12, 2002
Method of fabricating DRAM capacitor
UNITED MICROELECTRONICS CORP8 citations74
US6245380B1Jun 12, 2001
Method of forming bonding pad
UNITED MICROELECTRONICS CORP10 citations74
US6218238B1Apr 17, 2001
Method of fabricating DRAM capacitor
UNITED MICROELECTRONICS CORP9 citations74
US6180451B1Jan 30, 2001
Method of forming capacitor with a HSG layer
UNITED MICROELECTRONICS CORP7 citations74
US6083789AJul 4, 2000
Method for manufacturing DRAM capacitor
UNITED MICROELECTRONICS CORP9 citations74
US6057189AMay 2, 2000
Method of fabricating capacitor utilizing an ion implantation method
UNITED MICROELECTRONICS CORP9 citations74
US6048796AApr 11, 2000
Method of manufacturing multilevel metal interconnect
UNITED MICROELECTRONICS CORP12 citations74
US6287967B1Sep 11, 2001
Self-aligned silicide process
UNITED MICROELECTRONICS CORP14 citations73
US6146742ANov 14, 2000
Barrier/glue layer on polysilicon layer
UNITED MICROELECTRONICS CORP12 citations73
US5897373AApr 27, 1999
Method of manufacturing semiconductor components having a titanium nitride layer
UNITED MICROELECTRONICS CORP7 citations73
US6255177B1Jul 3, 2001
Method for fabricating a salicide gate
UNITED MICROELECTRONICS CORP13 citations72
HON HAI PREC IND CO LTD
14 patentsUS7841864B2Nov 30, 2010
Electrical contact for socket connector
HON HAI PREC IND CO LTD28 citations93
US7828576B2Nov 9, 2010
Burn-in test socket having cover with floatable pusher
HON HAI PREC IND CO LTD23 citations93
US7815440B2Oct 19, 2010
Electrical contact with interlocking arrangement
HON HAI PREC IND CO LTD25 citations93
US7785124B2Aug 31, 2010
Electrical connector having heat sink with large dissipation area
HON HAI PREC IND CO LTD21 citations93
US7559784B2Jul 14, 2009
IC socket
HON HAI PREC IND CO LTD27 citations92
USD761205SJul 12, 2016
Electrical connector
HON HAI PREC IND CO LTD15 citations84
US9190749B2Nov 17, 2015
Electrical connector and electrical contacts of the same
HON HAI PREC IND CO LTD10 citations84
US7972184B2Jul 5, 2011
Contact for burn-in socket
HON HAI PREC IND CO LTD9 citations84
US7956631B2Jun 7, 2011
Test socket for testing semiconductor package
HON HAI PREC IND CO LTD14 citations84
US7878837B2Feb 1, 2011
Socket connector having improved actuating mechanism for driving moving plate
HON HAI PREC IND CO LTD7 citations84
US7845988B2Dec 7, 2010
Electrical connector contact
HON HAI PREC IND CO LTD18 citations84
US7789671B2Sep 7, 2010
Electrical contact with overlapping structure
HON HAI PREC IND CO LTD17 citations84
US7946881B2May 24, 2011
Socket assembly with heat sink module
HON HAI PREC IND CO LTD16 citations83
US9110096B2Aug 18, 2015
Test socket with lower and upper retaining cover
HON HAI PREC IND CO LTD4 citations73
CHANG YEN-CHIH
2 patentsFOXCONN INTERCONNECT TECHNOLOGY LTD
2 patentsMACRONIX INT CO LTD
1 patentHSIEH WEN-YI
1 patentShowing the top 50 of 92 patents by PatentIndex Score.