Inventor
JIN LONGNAN
CN4 patents
Patents
4 patentsUS11450534B2Sep 20, 2022
Packaging process for side-wall plating with a conductive film
VISHAY GEN SEMICONDUCTOR LLC4 citations69
US11876003B2Jan 16, 2024
Semiconductor package and packaging process for side-wall plating with a conductive film
VISHAY GEN SEMICONDUCTOR LLC1 citations59
US11764075B2Sep 19, 2023
Package assembly for plating with selective molding
VISHAY GEN SEMICONDUCTOR LLC0 citations59
US11393699B2Jul 19, 2022
Packaging process for plating with selective molding
VISHAY GEN SEMICONDUCTOR LLC0 citations59