Inventor
TERAKADO YOSHIMITSU
JP27 patents
Patents
27 patentsUS4932584AJun 12, 1990
Method of wire bonding
SHINKAWA KK74 citations94
US5214259AMay 25, 1993
Method and apparatus for forming a ball at a bonding wire end
SHINKAWA KK26 citations92
US5024367AJun 18, 1991
Wire bonding method
SHINKAWA KK20 citations82
US5468927ANov 21, 1995
Wire bonding apparatus
SHINKAWA KK17 citations74
US5192018AMar 9, 1993
Wire bonding method
SHINKAWA KK17 citations74
US6595400B2Jul 22, 2003
Wire bonding apparatus
SHINKAWA KK8 citations73
US5988482ANov 23, 1999
Discharge abnormality detection device and method for use in wire bonding apparatus
SHINKAWA KK14 citations73
US5221037AJun 22, 1993
Wire bonding method and apparatus
SHINKAWA KK11 citations73
US5046654ASep 10, 1991
Ultrasonic wire bonding apparatus
SHINKAWA KK13 citations73
US5016803AMay 21, 1991
Wire bonding apparatus
SHINKAWA KK15 citations73
US5219112AJun 15, 1993
Wire bonding apparatus
SHINKAWA KK9 citations71
US5207370AMay 4, 1993
Wire bonding method and apparatus
SHINKAWA KK11 citations71
US5975835ANov 2, 1999
Lead frame conveying method and conveying apparatus
SHINKAWA KK9 citations70
US5058797AOct 22, 1991
Detection method for wire bonding failures
SHINKAWA KK18 citations69
US6502738B2Jan 7, 2003
Wire bonding apparatus
SHINKAWA KK4 citations63
US6645346B2Nov 11, 2003
Workpiece holding device for a bonding apparatus
SHINKAWA KK6 citations62
US5524811AJun 11, 1996
Wire bonding method
SHINKAWA KK5 citations62
US5485063AJan 16, 1996
Motor control circuit for a wire bonding apparatus
SHINKAWA KK2 citations62
US5386936AFeb 7, 1995
Wire bonding method
SHINKAWA KK3 citations62
US5046655ASep 10, 1991
Device for detecting height of bonding surface
SHINKAWA KK4 citations62
US6129255AOct 10, 2000
Wire bonding apparatus
SHINKAWA KK5 citations61
US5123585AJun 23, 1992
Wire bonding method
SHINKAWA KK6 citations61
US6439496B2Aug 27, 2002
Spool holder structure for a wire bonder
SHINKAWA KK3 citations60
US6141599AOct 31, 2000
Method for setting conveying data for a lead frame
SHINKAWA KK4 citations59
US5903463AMay 11, 1999
Raising-and-lowering data setting method for magazine elevator device
SHINKAWA KK4 citations59
US5287064AFeb 15, 1994
Bonding point polarity determining apparatus
SHINKAWA KK0 citations52
US6491203B2Dec 10, 2002
Wire bonding apparatus
SHINKAWA KK0 citations51