Inventor
DOLBEAR THOMAS P
US19 patents
⚠️ This page may combine multiple inventors who share the name “DOLBEAR THOMAS P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
10 patentsUS5926371AJul 20, 1999
Heat transfer apparatus which accommodates elevational disparity across an upper surface of a surface-mounted semiconductor device
ADVANCED MICRO DEVICES INC167 citations99
US5907474AMay 25, 1999
Low-profile heat transfer apparatus for a surface-mounted semiconductor device employing a ball grid array (BGA) device package
ADVANCED MICRO DEVICES INC112 citations98
US6828666B1Dec 7, 2004
Low inductance power distribution system for an integrated circuit chip
ADVANCED MICRO DEVICES INC61 citations96
US5963023AOct 5, 1999
Power surge management for high performance integrated circuit
ADVANCED MICRO DEVICES INC73 citations94
US6477047B1Nov 5, 2002
Temperature sensor mounting for accurate measurement and durability
ADVANCED MICRO DEVICES INC41 citations89
US6462956B1Oct 8, 2002
Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module
ADVANCED MICRO DEVICES INC7 citations74
US10242962B1Mar 26, 2019
Back side metallization
ADVANCED MICRO DEVICES INC3 citations72
US11488922B2Nov 1, 2022
Back side metallization
ADVANCED MICRO DEVICES INC0 citations62
US10957669B2Mar 23, 2021
Back side metallization
ADVANCED MICRO DEVICES INC0 citations62
US10431562B1Oct 1, 2019
Back side metallization
ADVANCED MICRO DEVICES INC0 citations51
MICROELECTRONICS & COMPUTER
7 patentsUS5170930ADec 15, 1992
Liquid metal paste for thermal and electrical connections
MICROELECTRONICS & COMPUTER168 citations99
US5328087AJul 12, 1994
Thermally and electrically conductive adhesive material and method of bonding with same
MICROELECTRONICS & COMPUTER155 citations98
US5344795ASep 6, 1994
Method for encapsulating an integrated circuit using a removable heatsink support block
MICROELECTRONICS & COMPUTER99 citations96
US5056706AOct 15, 1991
Liquid metal paste for thermal and electrical connections
MICROELECTRONICS & COMPUTER59 citations96
US4993482AFeb 19, 1991
Coiled spring heat transfer element
MICROELECTRONICS & COMPUTER80 citations96
US5309321AMay 3, 1994
Thermally conductive screen mesh for encapsulated integrated circuit packages
MICROELECTRONICS & COMPUTER37 citations92
US5265321ANov 30, 1993
Integrated circuit structure with heat exchanger elements secured thereto and method of making
MICROELECTRONICS & COMPUTER32 citations92