Inventor
DANDIA SANJAY
US23 patents
⚠️ This page may combine multiple inventors who share the name “DANDIA SANJAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
10 patentsUSD641720SJul 19, 2011
Circuit package lid
ADVANCED MICRO DEVICES INC29 citations90
USD645426SSep 20, 2011
Socket assembly
ADVANCED MICRO DEVICES INC7 citations83
USD633877SMar 8, 2011
Socket frame
ADVANCED MICRO DEVICES INC8 citations83
USD633880SMar 8, 2011
Socket housing
ADVANCED MICRO DEVICES INC8 citations83
US10242962B1Mar 26, 2019
Back side metallization
ADVANCED MICRO DEVICES INC3 citations72
US11488922B2Nov 1, 2022
Back side metallization
ADVANCED MICRO DEVICES INC0 citations62
US10957669B2Mar 23, 2021
Back side metallization
ADVANCED MICRO DEVICES INC0 citations62
US12482738B2Nov 25, 2025
Systems and methods for dimensioning a land grid array pad
ADVANCED MICRO DEVICES INC0 citations54
US10431562B1Oct 1, 2019
Back side metallization
ADVANCED MICRO DEVICES INC0 citations51
US10636736B2Apr 28, 2020
Land pad design for high speed terminals
ADVANCED MICRO DEVICES INC0 citations40
LSI LOGIC CORP
5 patentsUS5691568ANov 25, 1997
Wire bondable package design with maxium electrical performance and minimum number of layers
LSI LOGIC CORP106 citations96
US5749999AMay 12, 1998
Method for making a surface-mount technology plastic-package ball-grid array integrated circuit
LSI LOGIC CORP19 citations92
US5796171AAug 18, 1998
Progressive staggered bonding pads
LSI LOGIC CORP29 citations88
US5814892ASep 29, 1998
Semiconductor die with staggered bond pads
LSI LOGIC CORP19 citations83
US5753070AMay 19, 1998
Vacuum chuck tool for a making a plastic-package ball-grid array integrated circuit, and combination
LSI LOGIC CORP9 citations73