Inventor
NITTA SATYANARAYANA VENKATA
US9 patents
Patents
9 patentsUS6413852B1Jul 2, 2002
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
IBM264 citations99
US6346484B1Feb 12, 2002
Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures
IBM80 citations97
US6737725B2May 18, 2004
Multilevel interconnect structure containing air gaps and method for making
IBM70 citations96
US7790601B1Sep 7, 2010
Forming interconnects with air gaps
IBM26 citations91
US7084479B2Aug 1, 2006
Line level air gaps
IBM27 citations90
US7371684B2May 13, 2008
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme
IBM12 citations82
US8357608B2Jan 22, 2013
Multi component dielectric layer
IBM5 citations73
US7947907B2May 24, 2011
Electronics structures using a sacrificial multi-layer hardmask scheme
IBM5 citations71
US10847046B2Nov 24, 2020
Learning with smart blocks
IBM2 citations69