Inventor

PARK DOO HYUN

KR65 patents

⚠️ This page may combine multiple inventors who share the name “PARK DOO HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK DOO HYUN

AMKOR TECHNOLOGY INC

Fan-out semiconductor package

Substrate for semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor package and its manufacturing method

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Stiffener package and method of fabricating stiffener package

Semiconductor device and manufacturing method thereof

Wafer level fan out package and method of fabricating wafer level fan out package

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device using EMC wafer support system and fabricating method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives

Semiconductor device with reduced thickness

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device and manufacturing method thereof

Semiconductor device with redistribution layers formed utilizing dummy substrates

Semiconductor device using EMC wafer support system and fabricating method thereof

Electronic device package structure and method of fabricating the same

Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor package having more reliable electrical conductive patterns

Semiconductor device and manufacturing method thereof

Semiconductor device with plated pillars and leads

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

AMKOR TECH SINGAPORE HOLDING PTE LTD

Stiffener package and method of fabricating stiffener package

Stiffener package and method of fabricating stiffener package

Semiconductor device having upper and lower redistribution layers

Semiconductor device and manufacturing method thereof

Semiconductor device with redistribution layers formed utilizing dummy substrates

Stiffener package and method of fabricating stiffener package

Semiconductor device having a redistribution layer

Semiconductor device with redistribution layers formed utilizing dummy substrates

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device using EMC wafer support system and fabricating method thereof

Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device using EMC wafer support system and fabricating method thereof

Semiconductor device and manufacturing method thereof

PARK DOO HYUN

Semiconductor package with increased I/O density and method of making the same

Semiconductor package with increased I/O density and method of making same

KIM JIN YOUNG

Wafer level fan out package

DO WON CHUL

Semiconductor device and manufacturing method thereof

KOREA INST SCI & TECH

Mediator-less biofuel cell

UNIV MICHIGAN STATE

Electrode compositions and configurations for electrochemical bioreactor systems

ANAM IND CO LTD

Chip mounting plate construction of lead frame for semiconductor package

PAEK JONG SIK

Semiconductor device and manufacturing method thereof