Inventor

LEI JIANXIN

US29 patents

⚠️ This page may combine multiple inventors who share the name “LEI JIANXIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEI JIANXIN

APPLIED MATERIALS INC

Lowering tungsten resistivity by replacing titanium nitride with titanium silicon nitride

Selective cobalt removal for bottom up gapfill

Processing system and method of forming a contact

Methods and apparatus for smoothing dynamic random access memory bit line metal

Systems and methods for low resistivity physical vapor deposition of a tungsten film

Methods and devices using PVD ruthenium

Methods and devices for subtractive self-alignment

Methods and apparatus for passivating a target

Methods and apparatus for passivating a target

Methods for treating magnesium oxide film

Methods and devices for subtractive self-alignment

Plasma chamber target for reducing defects in workpiece during dielectric sputtering

Systems and methods for low resistivity physical vapor deposition of a tungsten film

Shutter disk for physical vapor deposition (PVD) chamber

Apparatus for reducing tungsten resistivity

Silicon-containing layer for bit line resistance reduction

Silicon-containing layer for bit line resistance reduction

Methods and apparatus for reducing tungsten resistivity

Methods and apparatus for processing a substrate

Molybdenum monolithic physical vapor deposition target

Ru liner above a barrier layer

Selective cobalt removal for bottom up gapfill

Methods and apparatus for filling a feature disposed in a substrate

Methods and apparatus for filling substrate features with cobalt

Tungsten silicide nitride films and methods of formation

Forming metal silicide on silicon-containing features of a substrate

Cap layer for bit line resistance reduction

WANG RONGJUN

Magnetron design for RF/DC physical vapor deposition

LEI JIANXIN

Methods for forming a metal gate structure on a substrate