Inventor

YEH SUNG-FENG

TW164 patents

⚠️ This page may combine multiple inventors who share the name “YEH SUNG-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEH SUNG-FENG

TAIWAN SEMICONDUCTOR MFG CO LTD

System on integrated chips and methods of forming same

Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias

Three-dimensional integrated circuit structure

Semiconductor structure and a manufacturing method thereof

System on integrated chips and methods of forming same

Packages with si-substrate-free interposer and method forming same

3DIC formation with dies bonded to formed RDLs

Method of forming semiconductor device package having testing pads on a topmost die

3DIC structure and method of manufacturing the same

Structure and formation method for chip package

Package structure for heat dissipation

Chip-on-wafer package and method of forming same

Integrated circuit package and method

Package structure and method of manufacturing the same

Integrated circuit package and method

Integrated circuit package and method

Package and manufacturing method thereof

Method of forming semiconductor device package having dummy devices on a first die

Semiconductor device and method of manufacture

Package structure

Bond pad structure for semiconductor device and method of forming same

Three-dimensional integrated circuit structures and methods of manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor packages and method of forming the same

Package structure for heat dissipation

Forming metal bonds with recesses

Semiconductor device packaging structure having through interposer vias and through substrate vias

Package structure and method of fabricating the same

Semiconductor structure and manufacturing method thereof

3D chip-on-wafer-on-substrate structure with via last process

3D chip-on-wafer-on-substrate structure with via last process

Semiconductor structure and method of manufacturing the same

Three-dimensional integrated circuit structure and bonded structure

Reticle for non-rectangular die

Package and manufacturing method thereof

Semiconductor component, package structure and manufacturing method thereof

Package structure for heat dissipation

Semiconductor device and method of manufacture

Package-on-package device

Integrated circuit package and method

Inactive structure on SoIC

Semiconductor packages

Integrated circuit packages and methods of forming the same

System formed through package-in-package formation

Manufacturing method of semiconductor structure

Package structure for heat dissipation

Integrated circuit package and method

Stacking structure, package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG

Chip-on-wafer package and method of forming same

NAN YA PRINTED CIRCUIT BOARD

Cutting mold for rigid-flexible circuit board and method for forming the same