Inventor
TSAI KUN-CHEN
TW10 patents
⚠️ This page may combine multiple inventors who share the name “TSAI KUN-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PHOENIX PREC TECHNOLOGY CORP
4 patentsUS7485970B2Feb 3, 2009
Semiconductor package substrate having contact pad protective layer formed thereon
PHOENIX PREC TECHNOLOGY CORP37 citations92
US7081402B2Jul 25, 2006
Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP34 citations92
US7012019B2Mar 14, 2006
Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP15 citations83
US7174631B2Feb 13, 2007
Method of fabricating electrical connection terminal of embedded chip
PHOENIX PREC TECHNOLOGY CORP8 citations73