Inventor
UEYAMA SHINJI
JP12 patents
⚠️ This page may combine multiple inventors who share the name “UEYAMA SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS11796608B2Oct 24, 2023
Magnetic property measurement apparatus
SAMSUNG ELECTRONICS CO LTD0 citations58
US12500107B2Dec 16, 2025
Mounting device and mounting method
SAMSUNG ELECTRONICS CO LTD0 citations57
US12560792B2Feb 24, 2026
Polarized microscope and intra image field correction analysis method
SAMSUNG ELECTRONICS CO LTD0 citations48
US12439607B2Oct 7, 2025
Inspection device
SAMSUNG ELECTRONICS CO LTD0 citations48
US12327579B2Jun 10, 2025
Inspection device
SAMSUNG ELECTRONICS CO LTD0 citations48
US9726204B2Aug 8, 2017
Fluid pressure actuator
SAMSUNG ELECTRONICS CO LTD1 citations48
US12051604B2Jul 30, 2024
Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US12535315B2Jan 27, 2026
Optical device and optical measurement method
SAMSUNG ELECTRONICS CO LTD0 citations46
US10444162B2Oct 15, 2019
Method of testing an object and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD0 citations38
US10847369B2Nov 24, 2020
Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor
SAMSUNG ELECTRONICS CO LTD0 citations37
US9082885B2Jul 14, 2015
Semiconductor chip bonding apparatus and method of forming semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations37