Inventor
KAJINAMI MASATO
JP12 patents
Patents
12 patentsUS10823682B2Nov 3, 2020
Water measurement apparatus
SAMSUNG ELECTRONICS CO LTD1 citations58
US12500107B2Dec 16, 2025
Mounting device and mounting method
SAMSUNG ELECTRONICS CO LTD0 citations57
US12444625B2Oct 14, 2025
Chip peeling apparatus and chip peeling method using the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US11314073B2Apr 26, 2022
Lighting device and inspection apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US9726204B2Aug 8, 2017
Fluid pressure actuator
SAMSUNG ELECTRONICS CO LTD1 citations48
US12557583B2Feb 17, 2026
Chip peeling apparatus and chip peeling method
SAMSUNG ELECTRONICS CO LTD0 citations47
US12051604B2Jul 30, 2024
Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations47
US12535315B2Jan 27, 2026
Optical device and optical measurement method
SAMSUNG ELECTRONICS CO LTD0 citations46
US9508577B2Nov 29, 2016
Semiconductor manufacturing apparatuses comprising bonding heads
SAMSUNG ELECTRONICS CO LTD1 citations46
US10444162B2Oct 15, 2019
Method of testing an object and apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD0 citations38
US10847369B2Nov 24, 2020
Wafer bonding method, method for manufacturing semiconductor device, and apparatus therefor
SAMSUNG ELECTRONICS CO LTD0 citations37
US9082885B2Jul 14, 2015
Semiconductor chip bonding apparatus and method of forming semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations37