Inventor
SAVIC JOVICA
US24 patents
⚠️ This page may combine multiple inventors who share the name “SAVIC JOVICA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
19 patentsUS6541137B1Apr 1, 2003
Multi-layer conductor-dielectric oxide structure
MOTOROLA INC133 citations96
US6232042B1May 15, 2001
Method for manufacturing an integral thin-film metal resistor
MOTOROLA INC57 citations96
US6349456B1Feb 26, 2002
Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes
MOTOROLA INC63 citations95
US6841080B2Jan 11, 2005
Multi-layer conductor-dielectric oxide structure
MOTOROLA INC26 citations90
US6103134AAug 15, 2000
Circuit board features with reduced parasitic capacitance and method therefor
MOTOROLA INC37 citations90
US7518465B2Apr 14, 2009
Tunable high impedance surface device
MOTOROLA INC8 citations83
US7361847B2Apr 22, 2008
Capacitance laminate and printed circuit board apparatus and method
MOTOROLA INC10 citations83
US7056800B2Jun 6, 2006
Printed circuit embedded capacitors
MOTOROLA INC17 citations83
US7038571B2May 2, 2006
Polymer thick film resistor, layout cell, and method
MOTOROLA INC12 citations83
US7193838B2Mar 20, 2007
Printed circuit dielectric foil and embedded capacitors
MOTOROLA INC14 citations81
US7444727B2Nov 4, 2008
Method for forming multi-layer embedded capacitors on a printed circuit board
MOTOROLA INC7 citations73
US7337528B2Mar 4, 2008
Textured dielectric patch antenna fabrication method
MOTOROLA INC6 citations72
US5545430AAug 13, 1996
Method and reduction solution for metallizing a surface
MOTOROLA INC8 citations72
US7105913B2Sep 12, 2006
Two-layer patterned resistor
MOTOROLA INC2 citations62
US7463113B2Dec 9, 2008
Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openings
MOTOROLA INC2 citations61
US7138068B2Nov 21, 2006
Printed circuit patterned embedded capacitance layer
MOTOROLA INC6 citations61
US7079373B2Jul 18, 2006
Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
MOTOROLA INC3 citations61
US7451540B2Nov 18, 2008
Method for fabricating a printed circuit board
MOTOROLA INC0 citations51
US7217369B2May 15, 2007
Meso-microelectromechanical system having a glass beam and method for its fabrication
MOTOROLA INC0 citations40
CISCO TECH INC
3 patentsUS9414497B2Aug 9, 2016
Semiconductor package including an embedded circuit component within a support structure of the package
CISCO TECH INC3 citations73
US10260782B2Apr 16, 2019
Heat dissipation in hermetically-sealed packaged devices
CISCO TECH INC1 citations61
US9688453B2Jun 27, 2017
Heat dissipation in hermetically-sealed packaged devices
CISCO TECH INC1 citations51