Inventor
CHOI SEUNG-MAN
KR24 patents
⚠️ This page may combine multiple inventors who share the name “CHOI SEUNG-MAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS6787460B2Sep 7, 2004
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses and conductive contacts so formed
SAMSUNG ELECTRONICS CO LTD44 citations95
US7911001B2Mar 22, 2011
Methods for forming self-aligned dual stress liners for CMOS semiconductor devices
SAMSUNG ELECTRONICS CO LTD29 citations92
US7514354B2Apr 7, 2009
Methods for forming damascene wiring structures having line and plug conductors formed from different materials
SAMSUNG ELECTRONICS CO LTD25 citations92
US7335590B2Feb 26, 2008
Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby
SAMSUNG ELECTRONICS CO LTD21 citations92
US7332764B2Feb 19, 2008
Metal-insulator-metal (MIM) capacitor and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD38 citations92
US6884710B2Apr 26, 2005
Semiconductor device having multi-layer copper line and method of forming same
SAMSUNG ELECTRONICS CO LTD21 citations92
US6548905B2Apr 15, 2003
Semiconductor device having multi-layer copper line and method of forming the same
SAMSUNG ELECTRONICS CO LTD30 citations92
US7586175B2Sep 8, 2009
Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface
SAMSUNG ELECTRONICS CO LTD19 citations84
US7387962B2Jun 17, 2008
Physical vapor deposition methods for forming hydrogen-stuffed trench liners for copper-based metallization
SAMSUNG ELECTRONICS CO LTD9 citations84
US7051934B2May 30, 2006
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses
SAMSUNG ELECTRONICS CO LTD15 citations83
US9625624B2Apr 18, 2017
Color improving film and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US9348066B2May 24, 2016
Film for improving color display and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US9349993B2May 24, 2016
Film for improving color display and method for manufacturing the same, and display apparatus including improved color display film
SAMSUNG ELECTRONICS CO LTD4 citations73
US7781276B2Aug 24, 2010
Methods of forming CMOS integrated circuits that utilize insulating layers with high stress characteristics to improve NMOS and PMOS transistor carrier mobilities
SAMSUNG ELECTRONICS CO LTD4 citations63
US7365025B2Apr 29, 2008
Methods of forming dual-damascene interconnect structures on semiconductor substrates using multiple planarization layers having different porosity characteristics
SAMSUNG ELECTRONICS CO LTD2 citations63
US7417302B2Aug 26, 2008
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US7341908B2Mar 11, 2008
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations51