Inventor
EMESH ISMAIL T
US21 patents
⚠️ This page may combine multiple inventors who share the name “EMESH ISMAIL T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
10 patentsUS9425092B2Aug 23, 2016
Methods for producing interconnects in semiconductor devices
APPLIED MATERIALS INC8 citations84
US10062607B2Aug 28, 2018
Methods for producing interconnects in semiconductor devices
APPLIED MATERIALS INC2 citations73
US9805976B2Oct 31, 2017
Co or Ni and Cu integration for small and large features in integrated circuits
APPLIED MATERIALS INC3 citations73
US9768060B2Sep 19, 2017
Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD
APPLIED MATERIALS INC6 citations73
US9245798B2Jan 26, 2016
Semiconductor reflow processing for high aspect ratio fill
APPLIED MATERIALS INC4 citations65
US8357599B2Jan 22, 2013
Seed layer passivation
APPLIED MATERIALS INC5 citations65
US10665503B2May 26, 2020
Semiconductor reflow processing for feature fill
APPLIED MATERIALS INC0 citations52
US10622252B2Apr 14, 2020
Co or Ni and Cu integration for small and large features in integrated circuits
APPLIED MATERIALS INC0 citations52
US9840788B2Dec 12, 2017
Method for electrochemically depositing metal on a reactive metal film
APPLIED MATERIALS INC0 citations39
US9828687B2Nov 28, 2017
Method for electrochemically depositing metal on a reactive metal film
APPLIED MATERIALS INC0 citations39
NORTHERN TELECOM LTD
8 patentsUS5789303AAug 4, 1998
Method of adding on chip capacitors to an integrated circuit
NORTHERN TELECOM LTD265 citations98
US5563762AOct 8, 1996
Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
NORTHERN TELECOM LTD160 citations98
US5452178ASep 19, 1995
Structure and method of making a capacitor for an intergrated circuit
NORTHERN TELECOM LTD177 citations96
US5407698AApr 18, 1995
Deposition of tungsten
NORTHERN TELECOM LTD100 citations96
US5354712AOct 11, 1994
Method for forming interconnect structures for integrated circuits
NORTHERN TELECOM LTD463 citations95
US5358889AOct 25, 1994
Formation of ruthenium oxide for integrated circuits
NORTHERN TELECOM LTD68 citations94
US5330931AJul 19, 1994
Method of making a capacitor for an integrated circuit
NORTHERN TELECOM LTD95 citations94
US5728603AMar 17, 1998
Method of forming a crystalline ferroelectric dielectric material for an integrated circuit
NORTHERN TELECOM LTD81 citations91