Inventor

O'NEILL MARK LEONARD

US86 patents

⚠️ This page may combine multiple inventors who share the name “O'NEILL MARK LEONARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

O'NEILL MARK LEONARD

AIR PROD & CHEM

Methods for using porogens and/or porogenated precursors to provide porous organosilica glass films with low dielectric constants

Halogenated organoaminosilane precursors and methods for depositing films comprising same

Porous low dielectric constant compositions and methods for making and using same

Mechanical enhancement of dense and porous organosilicate materials by UV exposure

Organosilicon precursors for interlayer dielectric films with low dielectric constants

Low dielectric constant material and method of processing by CVD

Non-thermal process for forming porous low dielectric constant films

Process for producing silicon and oxide films from organoaminosilane precursors

Nanoporous polymer films for extreme low and interlayer dielectrics

Methods for depositing films with organoaminodisilane precursors

Activated chemical process for enhancing material properties of dielectric films

Mechanical enhancement of dense and porous organosilicate materials by UV exposure

Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants

Methods to prepare silicon-containing films

High temperature atomic layer deposition of silicon oxide thin films

Methods of forming non-oxygen containing silicon-based films

Alkoxyaminosilane compounds and applications thereof

Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants

Mechanical enhancement of dense and porous organosilicate materials by UV exposure

Non-thermal process for forming porous low dielectric constant films

Method for removing carbon-containing residues from a substrate

High temperature atomic layer deposition of silicon oxide thin films

Low dielectric constant material and method of processing by CVD

Barrier chemical mechanical planarization slurries using ceria-coated silica abrasives

Low dishing copper chemical mechanical planarization

Barrier materials for display devices

Methods for depositing films with organoaminodisilane precursors

VERSUM MAT US LLC

Organoaminosilane precursors and methods for depositing films comprising same

Compositions and methods for making silicon containing films

Organoaminosilane precursors and methods for depositing films comprising same

Metal chemical mechanical planarization (CMP) composition and methods therefore

Low oxide trench dishing chemical mechanical polishing

Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications

Metal chemical mechanical planarization (CMP) composition and methods therefore

High oxide film removal rate shallow trench (STI) chemical mechanical planarization (CMP) polishing

Compositions and processes for depositing carbon-doped silicon-containing films

Low oxide trench dishing chemical mechanical polishing

XIAO MANCHAO

Organoaminosilane precursors and methods for making and using same

Organoaminosilane precursors and methods for depositing films comprising same

Process for producing silicon and oxide films from organoaminosilane precursors

Methods for depositing silicon dioxide or silicon oxide films using aminovinylsilanes

Organoaminosilane precursors and methods for making and using same

VRTIS RAYMOND NICHOLAS

Materials and methods of forming controlled void

Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants

Porogens, porogenated precursors and methods for using the same to provide porous organosilica glass films with low dielectric constants

Methods for using porogens for low k porous organosilica glass films

UNIV TEXAS

Surfactants for heterogeneous processes in liquid or supercritical CO2

YANG LIU

Dielectric films comprising silicon and methods for making same

LEE ERIC M

Chemical vapor deposition method

VERSON MAT US LLC

Organoaminosilane precursors and methods for depositing films comprising same